XC6SLX75-2FGG484C

The XC6SLX75-2FGG484C is a Spartan®-6 LX field programmable gate array (FPGA) from AMD, presented in a 484-BBGA package. It provides a balance of programmable logic, embedded memory, and I/O capacity for commercial-grade digital designs.

With 5,831 CLBs and 74,637 logic elements, approximately 3.17 Mbits of embedded RAM and 280 I/O pins, this device targets designs that require moderate logic density, on-chip memory, and a substantial number of external interfaces while operating within a 1.14 V–1.26 V supply range and a 0 °C to 85 °C temperature window.

Key Features

• Core Logic Capacity  5,831 CLBs and 74,637 logic elements enable implementation of mid-scale digital logic and custom architectures.
• Embedded Memory  Approximately 3.17 Mbits of on-chip RAM for buffering, FIFOs, and small embedded data structures without external memory.
• I/O Resources  280 dedicated I/O pins to support multiple parallel interfaces and peripheral connections.
• Power Supply  Operates from a core voltage range of 1.14 V to 1.26 V for core power planning and regulator selection.
• Package & Mounting  484-BBGA package (supplier device package: 484-FBGA, 23×23) in a surface-mount form factor to suit PCB space and assembly processes.
• Commercial Temperature Grade  Rated for operation from 0 °C to 85 °C for standard commercial environments.
• Regulatory Compliance  RoHS compliant.

Typical Applications

• Custom Logic and Prototyping  Use the device’s 74,637 logic elements and 5,831 CLBs to implement and validate custom digital functions and IP cores during development.
• I/O-Intensive Interfaces  280 I/O pins allow integration of multiple parallel interfaces, sensor arrays, and peripheral buses without immediate need for external expanders.
• On-Chip Data Handling  Approximately 3.17 Mbits of embedded RAM supports buffering, small packet queues, and temporary storage for streaming or control paths.
• Board-Level Integration  Surface-mount 484-BBGA packaging simplifies high-density PCB designs where board area and connector counts are constrained.

Unique Advantages

• Balanced Logic and Memory:  Combines 74,637 logic elements with roughly 3.17 Mbits of RAM to implement both control logic and local data storage on a single device.
• Substantial I/O Count:  280 I/O pins reduce the need for external interface components and simplify routing of multiple peripherals.
• Compact Surface-Mount Package:  484-BBGA / 484-FBGA (23×23) package supports high-density assemblies while remaining compatible with standard surface-mount processes.
• Commercial-Grade Operation:  Specified 0 °C to 85 °C operating range aligns with typical commercial deployments and system-level thermal designs.
• Regulatory Readiness:  RoHS compliance supports environmentally conscious manufacturing and supply chain requirements.

Why Choose XC6SLX75-2FGG484C?

The XC6SLX75-2FGG484C positions itself as a versatile mid-range Spartan®-6 LX FPGA option for commercial applications that need a combination of considerable logic resources, on-chip memory, and a high I/O count in a compact BGA footprint. Its specified voltage range and temperature grade allow straightforward integration into standard embedded and board-level designs.

This device is well suited for engineers and procurement teams designing systems that require scalable programmable logic, integrated memory for local buffering, and significant external connectivity while maintaining RoHS compliance and surface-mount assembly compatibility.

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