XC6SLX75-2FG676I

The XC6SLX75-2FG676I is a Spartan®-6 LX Field Programmable Gate Array (FPGA) from AMD. This surface-mount FPGA provides a high count of programmable logic resources, embedded memory, and a large number of I/O pins in a 676-ball BGA package targeted for industrial applications.

Designed for systems that require significant on-chip logic and memory capacity with industrial temperature tolerance, this device balances integration and deployment-ready robustness through its specified operating voltage and temperature range.

Key Features

• Logic Capacity  Approximately 74,637 logic elements for implementing complex digital logic and custom processing functions.
• Embedded Memory  Approximately 3.17 Mbits of on-chip RAM to support buffering, local data storage, and state machines without external memory.
• High I/O Count  408 user I/O pins to support wide parallel interfaces, multiple peripherals, and extensive board-level connectivity.
• Power Supply Range  Operates from 1.14 V to 1.26 V, enabling defined core-voltage integration in system power architectures.
• Industrial Temperature Range  Rated for operation from -40 °C to 100 °C, suitable for demanding environmental conditions.
• Package and Mounting  676-BGA (supplier package: 676-FBGA 27×27) in a surface-mount form factor for compact, high-density PCB designs.
• RoHS Compliant  Meets RoHS requirements for lead-free manufacturing and supply-chain compliance.

Typical Applications

• Industrial Control  Programmable logic and embedded memory enable custom control logic and real-time processing while supporting -40 °C to 100 °C operation.
• High-Density I/O Systems  Large I/O count suits designs that require numerous sensor, actuator, or peripheral interfaces on a single FPGA.
• Embedded Digital Processing  Substantial logic resources and on-chip RAM support application-specific processing, data routing, and protocol handling within embedded systems.

Unique Advantages

• Substantial logic integration: Approximately 74,637 logic elements reduce the need for multiple discrete devices and simplify system architecture.
• Significant on-chip memory: Approximately 3.17 Mbits of embedded RAM supports local buffering and state storage, minimizing external memory requirements.
• Extensive I/O capabilities: 408 I/O pins provide flexibility for complex interfacing and parallel connectivity without additional multiplexers.
• Industrial temperature resilience: Rated from -40 °C to 100 °C for deployment in harsh or temperature-variable environments.
• Compact BGA package: 676-ball FBGA (27×27) enables high-density board layouts while maintaining a robust surface-mount solution.
• Regulatory compliance: RoHS compliance supports lead-free manufacturing and facilitates regulatory alignment.

Why Choose XC6SLX75-2FG676I?

The XC6SLX75-2FG676I positions itself as a robust FPGA option for industrial and embedded designs that require a substantial amount of programmable logic, embedded memory, and high I/O density in a compact BGA package. Its specified supply voltage range and industrial temperature rating make it suitable for systems where reliability and environmental tolerance are priorities.

Backed by AMD as the manufacturer, this FPGA is a practical choice for engineers and procurement teams seeking a scalable, integrated programmable-logic device that supports complex digital designs while simplifying board-level integration and component counts.

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