XC6SLX75-2CSG484C

IC FPGA 328 I/O 484CSBGA
Part Description

Spartan®-6 LX Field Programmable Gate Array (FPGA) IC 328 3170304 74637 484-FBGA, CSPBGA

Quantity 315 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package484-CSPBGA (19x19)GradeCommercialOperating Temperature0°C – 85°C
Package / Case484-FBGA, CSPBGANumber of I/O328Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs5831Number of Logic Elements/Cells74637
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits3170304

Overview of XC6SLX75-2CSG484C – Spartan®-6 LX Field Programmable Gate Array (FPGA)

The XC6SLX75-2CSG484C is a Spartan®-6 LX Field Programmable Gate Array (FPGA) in a 484-pin CSPBGA/FBGA package. It provides a balance of programmable logic capacity, embedded memory, and I/O density for commercial applications requiring configurable digital logic and on-chip storage.

Key Features

  • Logic Capacity — 5,831 configurable logic blocks and 74,637 logic elements to implement complex custom logic and control functions.
  • Embedded Memory — Approximately 3.17 Mbits of on-chip RAM for buffering, look-up tables, and state storage.
  • I/O Density — 328 user I/O pins to support parallel interfaces, multiple peripherals, and board-level connectivity.
  • Power — Specified voltage supply range of 1.14 V to 1.26 V for device operation.
  • Package & Mounting — Available in a 484-CSPBGA (19×19) / 484-FBGA footprint, designed for surface-mount assembly.
  • Temperature & Grade — Commercial grade device with an operating temperature range of 0 °C to 85 °C.
  • Environmental Compliance — RoHS compliant.

Typical Applications

  • Commercial Embedded Systems — Implements configurable logic and on-chip memory for control, data processing, and interface tasks in commercial equipment.
  • Prototyping and Development — Offers substantial logic and I/O resources for evaluating custom digital designs and proof-of-concept implementations.
  • High‑I/O Peripheral Aggregation — Supports systems that require many external interfaces or parallel signal handling through its 328 I/O pins.

Unique Advantages

  • Significant logic resources: 74,637 logic elements enable implementation of sizable custom logic blocks without external ASICs or gate arrays.
  • On-chip memory capacity: Approximately 3.17 Mbits of embedded RAM reduces the need for external memory in many buffering and state-storage use cases.
  • High I/O count: 328 I/O pins allow flexible interfacing to peripherals, sensors, and bus systems on a single device.
  • Compact surface-mount packaging: 484-CSPBGA (19×19) footprint balances board space and I/O routing for dense PCBs.
  • Commercial temperature rating: 0 °C to 85 °C supports a wide range of non-industrial applications.
  • RoHS compliance: Meets common environmental standards for lead-free assembly and regulatory requirements.

Why Choose XC6SLX75-2CSG484C?

The XC6SLX75-2CSG484C positions itself as a versatile commercial-grade FPGA option where substantial programmable logic, meaningful embedded memory, and a high I/O count are required in a compact surface-mount package. Its specified voltage range and 0 °C to 85 °C operating window align it with a broad set of commercial embedded designs.

This device is suitable for designers seeking to consolidate logic, memory, and I/O on a single programmable device to reduce BOM complexity and accelerate development cycles while maintaining compliance with RoHS requirements.

Request a quote or contact sales to get pricing and availability for the XC6SLX75-2CSG484C and to discuss fit-for-purpose deployment in your next commercial design.

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