XC6SLX45T-N3FGG484I

The XC6SLX45T-N3FGG484I is a Spartan®-6 LXT field programmable gate array (FPGA) IC from AMD, supplied in a 484-ball BGA package. It combines a high count of configurable logic resources, substantial on-chip memory, and broad I/O density to address industrial embedded designs that require configurable digital logic and interfacing capability.

Key capabilities include 3,411 CLBs, approximately 2.14 Mbits of embedded memory, 296 I/O pins, and an industrial operating temperature range, enabling deployment where extended temperature performance and high integration are required.

Key Features

• Core Logic 3,411 configurable CLBs and 43,661 logic elements provide extensive programmable logic capacity for custom digital functions.
• Embedded Memory Approximately 2.14 Mbits of on-chip RAM to support buffering, state storage, and data path implementations without external memory.
• I/O Density 296 I/O pins to support wide parallel interfaces, multiple peripherals, and flexible system connectivity.
• Power Supported core voltage range of 1.14 V to 1.26 V for the device core supply.
• Package and Mounting 484-ball BBGA (supplier package: 484-FBGA, 23 × 23 mm) in a surface-mount form factor for compact board integration.
• Temperature and Grade Industrial-grade device rated for operation from −40 °C to 100 °C for deployment in environments with extended temperature requirements.
• Environmental Compliance RoHS compliant to meet environmental and materials requirements.

Typical Applications

• Industrial Control: The industrial temperature range and robust logic capacity make this FPGA suitable for control logic, sequencing, and rugged embedded controllers.
• Embedded Systems: High I/O count and significant on-chip memory support peripheral interfacing, custom protocol handling, and local data processing in embedded platforms.
• Communications and Interfaces: Dense I/O and programmable logic enable implementation of custom interface logic and data-path functions for communication equipment.
• Prototyping and Custom Logic: Reconfigurable CLBs and abundant logic elements allow designers to prototype and iterate custom digital functions directly in silicon.

Unique Advantages

• High Logic Capacity: 43,661 logic elements provide room for complex state machines, datapaths, and bespoke logic implementations without excessive partitioning.
• Substantial On-Chip Memory: Approximately 2.14 Mbits of embedded RAM reduces dependence on external memory for many buffering and temporary storage needs.
• Broad I/O Connectivity: 296 I/O pins support extensive peripheral and bus connections, simplifying board-level design for multi-interface systems.
• Industrial Temperature Performance: Rated from −40 °C to 100 °C to support deployment in temperature-variable environments.
• Compact BGA Package: 484-ball FBGA (23 × 23 mm) surface-mount package enables high-density board layouts while maintaining thermal and electrical performance.
• RoHS Compliant: Meets common environmental material restrictions for modern product requirements.

Why Choose XC6SLX45T-N3FGG484I?

As a Spartan®-6 LXT FPGA from AMD, the XC6SLX45T-N3FGG484I delivers a balanced combination of logic density, embedded memory, and I/O capability in a compact 484-BBGA package. Its industrial-grade temperature rating and RoHS compliance make it suitable for designs that require reliable operation across a wide temperature range and adherence to material standards.

This device is well suited for engineers and purchasing teams building embedded or industrial systems that need configurable digital logic, extensive interfacing, and on-chip memory without compromising board density. Its specification set supports scalable designs where integration, deterministic logic behavior, and environmental robustness are priorities.

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