XC6SLX45T-N3CSG324I

The XC6SLX45T-N3CSG324I is a Spartan®-6 LXT Field Programmable Gate Array (FPGA) IC engineered for industrial applications. It combines a substantial programmable fabric with embedded memory and a broad I/O count in a compact 324-LFBGA / 324-CSPBGA package.

This device delivers 43,661 logic elements, approximately 2.14 Mbits of on-chip RAM, and 190 I/O pins while operating across an industrial temperature range and a low-voltage core supply, making it suitable for designs that require integrated logic, memory, and flexible I/O within industrial environments.

Key Features

• Core Logic 43,661 logic elements provide extensive programmable resources for custom digital logic and glue-logic integration.
• Embedded Memory Approximately 2.14 Mbits of on-chip RAM for buffering, state storage, and on-chip data structures.
• I/O Density 190 user I/O pins support connectivity to peripherals, sensors, and external interfaces.
• Power Core voltage supply range of 1.14 V to 1.26 V to match system power-rail requirements and enable stable core operation.
• Package and Mounting 324-LFBGA / 324-CSPBGA package with supplier device package listed as 324-CSPBGA (15x15); surface-mount construction for compact board designs.
• Industrial Temperature Range Rated for operation from -40 °C to 100 °C to meet thermal conditions found in industrial applications.
• Regulatory Compliance RoHS compliant.

Typical Applications

• Industrial Control Systems Industrial temperature rating and a high logic count make this FPGA suitable for control and automation tasks that require reliable operation in harsh environments.
• Embedded Processing and Glue Logic Large logic resources and on-chip RAM allow consolidation of custom processing blocks, protocol handling, and system glue into a single device.
• I/O-Intensive Designs With 190 I/O pins, the device supports designs that need broad peripheral or sensor interfacing without excessive external multiplexing.

Unique Advantages

• High Integration: 43,661 logic elements plus on-chip RAM reduce the need for external logic and memory devices, simplifying BOM and board layout.
• Industrial Reliability: Specified operation from -40 °C to 100 °C and RoHS compliance support deployment in industrial environments with environmental constraints.
• Flexible I/O Capacity: 190 I/O pins enable direct connection to a wide range of peripherals and sensors, minimizing external interface components.
• Compact Packaging: 324-LFBGA / 324-CSPBGA packaging and surface-mount mounting allow dense PCB implementations in space-constrained designs.
• Low-Voltage Core: A narrow core supply range (1.14 V to 1.26 V) assists predictable power design and integration with modern power rails.

Why Choose XC6SLX45T-N3CSG324I?

The XC6SLX45T-N3CSG324I positions itself as a balanced solution for industrial and embedded designs that require significant programmable logic, embedded memory, and broad I/O in a compact package. Its combination of 43,661 logic elements, approximately 2.14 Mbits of on-chip RAM, and 190 I/O pins provides designers room to integrate custom logic and reduce component count.

This FPGA is appropriate for engineering teams focused on scalable, robust implementations where industrial temperature capability, package density, and predictable core-voltage requirements matter. It offers long-term value through high integration and specifications aligned with industrial deployment scenarios.

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