XC6SLX45T-N3FG484C

IC FPGA 296 I/O 484FBGA
Part Description

Spartan®-6 LXT Field Programmable Gate Array (FPGA) IC 296 2138112 43661 484-BBGA

Quantity 723 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package484-FBGA (23x23)GradeCommercialOperating Temperature0°C – 85°C
Package / Case484-BBGANumber of I/O296Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs3411Number of Logic Elements/Cells43661
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits2138112

Overview of XC6SLX45T-N3FG484C – Spartan®-6 LXT FPGA, 484-BBGA

The XC6SLX45T-N3FG484C is a Spartan®-6 LXT Field Programmable Gate Array (FPGA) IC from AMD, delivered in a 484-BBGA package. It combines a substantial logic fabric with on-chip memory and a high I/O count to address commercial-grade reconfigurable logic requirements.

Key device attributes include 3,411 configurable logic blocks (CLBs) providing 43,661 logic elements, approximately 2.14 Mbits of embedded RAM, and 296 user I/Os, making it suitable for commercial embedded and I/O‑intensive designs that operate within a 0 °C to 85 °C range.

Key Features

  • Core Logic  3,411 configurable logic blocks (CLBs) delivering 43,661 logic elements for implementing custom digital functions and state machines.
  • Embedded Memory  Approximately 2.14 Mbits of on-chip RAM (2,138,112 total bits) for buffering, packet processing, and local storage of intermediate data.
  • I/O Capacity  296 general-purpose I/Os to support multi-channel interfaces and parallel connectivity to external peripherals.
  • Packaging & Mounting  484-BBGA package (supplier device package: 484-FBGA (23x23)) with surface-mount mounting type for compact board-level integration.
  • Power  Core voltage supply range of 1.14 V to 1.26 V for device operation.
  • Temperature & Grade  Commercial grade device specified for operation from 0 °C to 85 °C and RoHS compliant.

Typical Applications

  • Commercial embedded systems  Use the FPGA to implement custom logic, protocol handling, and control functions where a commercial-grade temperature range is acceptable.
  • I/O‑intensive interfaces  Leverage 296 I/Os for bridging multiple peripherals, parallel data buses, or multi-channel I/O subsystems.
  • Prototyping and design validation  Deploy the programmable fabric and CLB resources for iterative development and early functional validation of custom logic.
  • Data buffering and local processing  Utilize approximately 2.14 Mbits of embedded RAM for packet buffering, FIFO staging, and intermediate data storage close to logic.

Unique Advantages

  • High logic density: 43,661 logic elements give designers substantial capacity for implementing complex functions without external ASICs.
  • Significant on-chip memory: Approximately 2.14 Mbits of embedded RAM reduces the need for external memory in many buffering and staging applications.
  • Extensive I/O count: 296 I/Os enable broad peripheral connectivity and flexible board-level partitioning.
  • Compact surface-mount package: 484-BBGA (supplier: 484-FBGA (23x23)) allows dense PCB integration while preserving routing options.
  • Commercial-grade operating range: Specified for 0 °C to 85 °C to match typical commercial electronics deployment scenarios.
  • RoHS compliant: Conforms to environmental requirements for lead-free assembly and regulatory compliance.

Why Choose XC6SLX45T-N3FG484C?

The XC6SLX45T-N3FG484C positions itself as a flexible, commercially graded FPGA option for designs that require a balance of logic capacity, on-chip memory, and a high I/O count. Its combination of 3,411 CLBs, 43,661 logic elements, roughly 2.14 Mbits of embedded RAM, and 296 I/Os supports a wide range of commercial embedded and I/O-driven applications.

Designed and manufactured by AMD, this Spartan®-6 LXT device provides a compact footprint with a 484-BBGA package and surface-mount compatibility, while offering clear electrical and thermal operating parameters to aid system integration and procurement decisions.

Request a quote or submit a pricing inquiry today to evaluate XC6SLX45T-N3FG484C for your next commercial FPGA design project.

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