XC6SLX75-2FGG676C

The XC6SLX75-2FGG676C is a Spartan®-6 LX field programmable gate array designed for commercial embedded applications. It combines a mid-range logic capacity, on-chip memory, and a high I/O count in a compact 676-ball FBGA package for surface-mount assembly.

Key architectural attributes include 5,831 configurable logic blocks (CLBs) yielding 74,637 logic elements, approximately 3.17 Mbits of embedded memory, and a 408-pin I/O count, making it suitable for designs that require programmable logic, moderate memory, and flexible I/O connectivity within a commercial temperature range.

Key Features

• Core Logic — 5,831 CLBs providing 74,637 logic elements for implementing custom digital logic and FPGA-based acceleration.
• Embedded Memory — Approximately 3.17 Mbits of on-chip RAM to support buffering, packet staging, and local data storage within user logic.
• I/O Capacity — 408 user I/O pins to drive or interface with a wide range of external peripherals and subsystems.
• Power — Core voltage supply range of 1.14 V to 1.26 V to match target power architectures and enable stable core operation.
• Package & Mounting — 676-FBGA (27×27) package, 676-BGA case, designed for surface-mount PCB assembly in space-conscious designs.
• Operating Range — Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Compliance — RoHS compliant for environmental regulatory alignment.

Typical Applications

• Commercial Embedded Systems — Used to implement custom control logic and data path functions in compact, surface-mount commercial products.
• I/O-Intensive Control — Suitable for applications that require a high number of general-purpose I/O signals for interfacing sensors, actuators, or external peripherals.
• Prototyping and Development — Useful for FPGA-based prototyping where a balance of logic density and on-chip memory is required within a commercial temperature envelope.

Unique Advantages

• High Logic Density: 74,637 logic elements provide substantial capacity for implementing complex finite-state machines, datapaths, and control logic.
• Generous Embedded Memory: Approximately 3.17 Mbits of on-chip RAM reduces reliance on external memory for intermediate buffering and local storage.
• Extensive I/O Count: 408 I/O pins enable broad peripheral connectivity and flexible board-level partitioning.
• Compact FBGA Package: The 676-FBGA (27×27) package delivers a small footprint for space-constrained PCBs while supporting surface-mount assembly.
• Commercial Temperature Grade: Rated 0 °C to 85 °C for deployments in commercial environments where standard operating temperatures apply.
• RoHS Compliant: Conforms to RoHS requirements to support regulatory compliance in product manufacturing.

Why Choose XC6SLX75-2FGG676C?

The XC6SLX75-2FGG676C provides a balanced combination of logic capacity, embedded memory, and extensive I/O in a compact 676-FBGA package, tailored for commercial embedded designs. Its 5,831 CLBs and 74,637 logic elements support substantial programmable logic implementation while the approximately 3.17 Mbits of on-chip RAM address local storage needs.

Engineers specifying this part benefit from a commercial-grade FPGA that aligns with surface-mount manufacturing processes, a defined core voltage range, and RoHS compliance—offering a predictable platform for mid-range programmable logic applications where space, I/O, and on-chip memory are important considerations.

Request a quote or submit a purchasing inquiry to obtain pricing and availability for the XC6SLX75-2FGG676C for your next commercial FPGA design.