XC6SLX75-3FGG676I

The XC6SLX75-3FGG676I is a Spartan®-6 LX Field Programmable Gate Array (FPGA) from AMD, provided in a 676-ball BGA package. It delivers a substantial on-chip resource set including logic elements, embedded RAM, and a high I/O count for compact, programmable hardware designs.

Designed for engineers and procurement teams who require programmable logic with measurable capacity and industrial-grade operating range, this device combines approximately 74,637 logic elements, around 3.17 Mbits of embedded memory, and 408 I/Os to support complex, high-density implementations.

Key Features

• Logic Capacity — 74,637 logic elements for implementing substantial custom digital logic and finite-state designs.
• Embedded Memory — Approximately 3.17 Mbits of on-chip RAM to support buffering, FIFOs, and small data storage without external memory.
• I/O Density — 408 general-purpose I/O pins to accommodate complex interfacing and parallel connectivity requirements.
• Power Supply — Nominal supply range of 1.14 V to 1.26 V to match system power rail planning.
• Package and Mounting — 676-BGA package (supplier package: 676-FBGA, 27×27) with surface-mount mounting for high-density PCB designs.
• Industrial Temperature Range — Rated for operation from −40 °C to 100 °C, suitable for industrial environments.
• Regulatory Compliance — RoHS-compliant construction.

Typical Applications

• Custom digital logic — Deploy substantial combinational and sequential logic using 74,637 logic elements to implement bespoke processing or control functions.
• On-chip buffering and data handling — Leverage approximately 3.17 Mbits of embedded RAM for temporary data storage, FIFOs, and small memory structures without immediate reliance on external memory.
• High-density I/O interfacing — Use the 408 available I/Os for parallel peripherals, bus bridging, and multi-channel signal routing in compact designs.

Unique Advantages

• Substantial logic resources: 74,637 logic elements enable large-scale programmable designs within a single FPGA, reducing the need for multiple devices.
• Integrated memory: Approximately 3.17 Mbits of on-chip RAM lowers external memory dependency and simplifies board-level BOM.
• High I/O count: 408 I/Os provide flexibility for complex interface requirements and reduce the need for external I/O expanders.
• Industrial robustness: Rated for −40 °C to 100 °C operation, supporting deployments in demanding temperature environments.
• Compact, manufacturable package: 676-BGA (676-FBGA, 27×27) surface-mount package supports dense PCB layouts and automated assembly processes.
• RoHS compliance: Meets RoHS requirements for lead-free manufacturing and environmental compliance.

Why Choose XC6SLX75-3FGG676I?

The XC6SLX75-3FGG676I positions itself as a solid choice for designs that require a balance of logic density, on-chip memory, and I/O capacity within a single industrial-grade FPGA package. Its combination of approximately 74,637 logic elements, around 3.17 Mbits of embedded RAM, and 408 I/Os makes it suitable for compact systems that need significant programmable resources without expanding board complexity.

For teams focused on scalable, reliable hardware development, this device offers measurable on-chip resources, a defined operating voltage range, and a robust temperature rating that support long-term deployment and straightforward integration into production workflows.

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