XC6SLX75-L1FG676I

The XC6SLX75-L1FG676I is a Spartan®-6 LX field programmable gate array (FPGA) in a 676-ball BGA package. It provides a substantial programmable logic resource with 74,637 logic elements, approximately 3.17 Mbits of embedded memory and 408 user I/O pins, suitable for designs that require significant on-chip logic and I/O density.

Packaged for surface-mount assembly and specified for industrial use, the device supports a core supply range of 1.14 V to 1.26 V and an operating temperature range of −40 °C to 100 °C. The part is RoHS compliant.

Key Features

• Logic Capacity  74,637 logic elements provide a large fabric for implementing custom digital functions and complex logic networks.
• Embedded Memory  Approximately 3.17 Mbits of on-chip RAM to support buffering, state storage and logic-local data handling.
• I/O Density  408 user I/O pins enable broad interface options and signal routing for multi-channel or multi-protocol designs.
• Package  676-BGA (supplier package: 676-FBGA, 27×27) provides high pin count in a compact footprint for board-level integration.
• Power  Core voltage supply range of 1.14 V to 1.26 V for defined power-up and operating conditions.
• Temperature Range  Rated for industrial operation from −40 °C to 100 °C to support extended ambient environments.
• Mounting & Compliance  Surface-mount device with RoHS compliance for lead-free assembly processes.

Typical Applications

• Industrial Control Systems  Programmable logic and I/O density support control, sequencing and interface aggregation in industrial equipment within an industrial temperature window.
• Embedded Processing & Custom Logic  Large logic capacity and embedded RAM enable offloading custom digital processing and state machines from fixed-function ASICs.
• I/O Aggregation and Protocol Bridging  High pin count is suited to designs that consolidate multiple interfaces or bridge disparate signal domains.
• Prototyping and System Integration  Surface-mount 676-BGA package with extensive logic resources is applicable for hardware prototypes and final system integration where board space and I/O are at a premium.

Unique Advantages

• Significant Logic Resources: 74,637 logic elements accommodate large logic designs without immediate requirement to partition across multiple devices.
• On-Chip Memory: Approximately 3.17 Mbits of embedded RAM reduces external memory needs for many buffering and state-retention tasks.
• High I/O Count: 408 I/O pins enable dense connectivity and simplify system-level routing for multi-signal applications.
• Industrial Temperature Capability: Rated for −40 °C to 100 °C to match environments with extended temperature requirements.
• Compact, High-Pin Package: 676-BGA (27×27) balances high pin count with a compact PCB footprint for space-constrained designs.
• RoHS Compliant: Supports lead-free assembly and environmental compliance goals.

Why Choose XC6SLX75-L1FG676I?

The XC6SLX75-L1FG676I delivers a combination of sizable programmable logic, on-chip RAM and extensive I/O in a compact 676-BGA package, presented in an industrial-grade rating. These characteristics make it well suited for engineers developing systems that require substantial custom logic, local memory resources and high I/O density while operating across an extended temperature range.

For designs that prioritize integrated logic capacity and board-level I/O consolidation with RoHS compliance and surface-mount packaging, this device offers a clear, specification-driven choice based on the supplied electrical, thermal and mechanical parameters.

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