XC6SLX75-L1FGG484I

The XC6SLX75-L1FGG484I is a Spartan®-6 LX family Field Programmable Gate Array (FPGA) presented in a 484-ball BBGA package. It delivers a balanced combination of programmable logic resources, on-chip memory, and I/O density for embedded and industrial applications.

With 74,637 logic elements, approximately 3.17 Mbits of embedded memory, and 280 user I/O, this device targets designs that require moderate logic capacity, flexible I/O, and operation across an industrial temperature range.

Key Features

• Core Logic  Provides 74,637 logic elements suitable for medium-complexity digital logic, signal processing, and control implementations.
• Embedded Memory  Approximately 3.17 Mbits of on-chip RAM for buffering, FIFOs, and small lookup tables or state storage.
• I/O Capacity  280 user I/O pins to support multiple peripheral interfaces, external memory connections, and board-level integration.
• Power  Core supply range of 1.14 V to 1.26 V to match system power rails and support stable device operation.
• Package and Mounting  484-BBGA package; supplier device package listed as 484-FBGA (23×23). Surface-mount construction for compact PCB assembly.
• Operating Range  Industrial-grade operation from -40 °C to 100 °C for deployment in temperature-challenging environments.
• Compliance  RoHS compliant to support environmental and regulatory requirements.

Typical Applications

• Industrial Controls  Logic-dense control functions, sensor interfacing, and custom sequencing in industrial equipment operating across wide temperature ranges.
• Embedded Processing  Custom datapath acceleration and glue-logic for embedded systems requiring deterministic hardware processing and on-chip RAM.
• Interface and I/O Expansion  Providing additional digital interfaces and protocol bridging where numerous user I/O lines are required.

Unique Advantages

• Substantial Logic Capacity: 74,637 logic elements enable implementation of complex finite state machines, custom accelerators, and moderate-scale digital designs.
• On-Chip Memory: Approximately 3.17 Mbits of embedded RAM reduces dependence on external memory for buffering and small data stores, simplifying board design.
• High I/O Count: 280 user I/O pins provide flexibility to connect to multiple peripherals, sensors, or external devices without extra level-shifters.
• Industrial Temperature Rating: Rated for -40 °C to 100 °C, supporting deployment in industrial environments where extended temperature tolerance is required.
• Compact Surface-Mount Package: 484-ball BBGA (supplier 484-FBGA 23×23) enables a high-pin-count solution in a compact footprint for space-constrained PCBs.
• RoHS Compliance: Meets RoHS requirements to support environmental compliance goals in product manufacturing.

Why Choose XC6SLX75-L1FGG484I?

The XC6SLX75-L1FGG484I positions itself as a practical, industrial-grade FPGA choice for designs that need a solid mix of logic density, embedded memory, and extensive I/O without exceeding moderate device complexity. Its voltage and thermal specifications support reliable operation in embedded and industrial systems.

This device suits engineers and procurement teams building scalable hardware solutions that benefit from on-chip memory, a high number of user I/O, and a compact surface-mount package—backed by RoHS compliance for production deployments.

Request a quote or submit an inquiry to discuss availability, pricing, and how the XC6SLX75-L1FGG484I can fit your next design.