XC6SLX75-N3CSG484I

The XC6SLX75-N3CSG484I is a Spartan®-6 LX field programmable gate array (FPGA) optimized for industrial and embedded designs requiring significant logic capacity and flexible I/O. It combines a high count of logic elements, multi-megabit on-chip RAM, and a dense 484‑CSPBGA package to address space-constrained, performance-sensitive applications.

Designed for operation across a wide industrial temperature range and low-voltage core supplies, this device targets applications that need reliable programmable logic with compact board integration and substantial interface capability.

Key Features

• Core and Logic Approximately 74,637 logic elements provide substantial programmable logic resources for complex digital functions and custom hardware acceleration.
• Embedded Memory Approximately 3.17 Mbits of on-chip RAM support data buffering, FIFOs, and state storage without requiring external memory for many use cases.
• I/O Capability 328 user I/O pins enable a broad range of peripheral connectivity and high pin-count interface routing in a single device.
• Power Core supply range of 1.14 V to 1.26 V supports low-voltage operation and integration into modern power domains.
• Package and Mounting 484‑CSPBGA (19×19) surface-mount package provides a compact footprint for high-density board designs.
• Temperature Range Rated for industrial operation from −40°C to 100°C, suitable for deployment in harsher environments.
• Compliance RoHS compliant to meet environmental and manufacturing requirements.

Typical Applications

• Industrial Control — Programmable logic and robust temperature rating make the device suitable for PLCs, motor control interfaces, and factory automation modules.
• Embedded Processing — Use the FPGA for custom datapaths, protocol processing, or hardware accelerators within embedded systems.
• I/O-Intensive Systems — High I/O count allows integration of multiple interfaces, sensors, and peripherals without external I/O expanders.
• Compact Board Designs — The 484‑CSPBGA package supports dense PCB layouts where board space is limited.

Unique Advantages

• High Logic Capacity: Approximately 74,637 logic elements enable substantial on-chip functionality and consolidation of discrete logic into a single programmable device.
• Multi‑Mbit On‑Chip RAM: Around 3.17 Mbits of embedded memory reduce dependence on external RAM for many buffering and storage needs.
• Extensive I/O Count: 328 user I/Os simplify system-level integration by supporting many peripherals and interfaces directly.
• Industrial Temperature Rating: −40°C to 100°C operation supports deployment in temperature-challenging environments common in industrial applications.
• Compact, High‑Density Package: The 484‑CSPBGA (19×19) footprint enables high integration in space-constrained designs.
• RoHS Compliant: Meets common environmental and manufacturing standards for lead-free assembly.

Why Choose XC6SLX75-N3CSG484I?

The XC6SLX75-N3CSG484I delivers a balanced combination of logic density, embedded memory, and I/O capacity in a compact 484‑CSPBGA package, making it well suited for industrial and embedded designs that require reliable programmable logic in limited board space. Its low-voltage core supply and industrial temperature rating support integration into demanding power and environmental domains.

Manufactured by AMD, this Spartan‑6 LX device is aimed at engineers and procurement teams looking for a versatile FPGA platform that consolidates functions, reduces BOM complexity, and provides the on-chip resources needed for a wide range of custom digital designs.

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