XC6SLX75-N3FG676C

The XC6SLX75-N3FG676C is a Spartan®-6 LX field programmable gate array from AMD. It provides a balanced combination of configurable logic, embedded memory, and high I/O density in a 676-FBGA (27×27) surface-mount package.

Key on-device resources include 74,637 logic elements, approximately 3.17 Mbits of embedded RAM, 408 I/O pins and 5,831 configurable logic blocks (CLBs). The device operates from a 1.14 V to 1.26 V supply range and is specified for commercial temperature operation from 0 °C to 85 °C.

Key Features

• Core Logic  Contains 74,637 logic elements and 5,831 CLBs to implement custom digital logic and control functions.
• Embedded Memory  Approximately 3.17 Mbits of on-chip RAM for buffering, state machines, and small data stores.
• I/O Density  408 user I/O pins to support parallel interfaces, multiple buses, and mixed-signal board-level connectivity.
• Power  Device core supply specified from 1.14 V to 1.26 V for consistent power delivery in designs targeting Spartan-6 voltage domains.
• Package & Mounting  Available in a 676-FBGA (27×27) / 676-BGA package, optimized for surface-mount assembly and compact PCB footprints.
• Operating Range & Grade  Commercial grade device with an operating temperature range of 0 °C to 85 °C.
• Compliance  RoHS compliant to meet standard environmental and manufacturing requirements.

Typical Applications

• High-density I/O interfacing  Use the 408 I/O pins for parallel data exchange, board-level signal aggregation, or multi-channel I/O expansion.
• Embedded control and state machines  Leverage 74,637 logic elements and CLBs to implement custom control logic, sequencers, and protocol handling.
• Data buffering and temporary storage  Approximately 3.17 Mbits of on-chip RAM supports FIFOs, small packet buffers, and scratchpad memory.

Unique Advantages

• Balanced resource set:  Combines substantial logic capacity with embedded memory to support mid-range FPGA designs without external RAM for many use cases.
• High I/O count:  408 I/O pins simplify interfacing to multiple peripherals and parallel buses, reducing the need for external I/O expanders.
• Compact, surface-mount package:  676-FBGA (27×27) package supports dense PCB layouts and automated assembly processes.
• Commercial temperature grading:  Specified 0 °C to 85 °C operation for standard commercial applications and environments.
• RoHS compliance:  Meets common environmental and manufacturing requirements for lead-free assembly.

Why Choose XC6SLX75-N3FG676C?

The XC6SLX75-N3FG676C offers a practical balance of programmable logic, embedded memory and I/O capability in a compact BGA package, making it well suited for embedded digital designs that require moderate logic density, significant I/O, and on-chip RAM. Its commercial temperature range and RoHS compliance support typical production environments and assembly flows.

As an AMD Spartan-6 LX device, it provides a predictable platform for developers and procurement teams seeking a field-programmable solution with clear, verifiable specifications for logic, memory and I/O resources.

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