XC6SLX75-N3FGG676C

The XC6SLX75-N3FGG676C is a Spartan®-6 LX Field Programmable Gate Array (FPGA) provided in a 676-BGA package. Designed for commercial applications, it delivers a balance of programmable logic capacity, on-chip memory, and high I/O count for embedded and board-level system designs.

With a defined core supply voltage range and a commercial operating temperature window, this device is intended for designers who need predictable electrical characteristics and a compact BGA footprint for surface-mount assembly.

Key Features

• FPGA Core Spartan-6 LX architecture in a Field Programmable Gate Array form factor for programmable logic implementation.
• Logic Capacity Approximately 74,637 logic elements to implement complex combinational and sequential logic.
• Embedded Memory Approximately 3.17 Mbits of on-chip RAM for buffering, packet storage, and state retention.
• I/O Density 408 user I/O pins to support multiple interfaces and peripheral connections.
• Power Core voltage supply range of 1.14 V to 1.26 V to match system power rails and validate power budgeting.
• Package & Mounting 676-FBGA (27×27) package, 676-BGA footprint, designed for surface-mount assembly on compact PCBs.
• Operating Conditions Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Environmental Compliance RoHS compliant to support regulatory requirements for lead-free manufacturing.

Typical Applications

• Commercial Embedded Systems — Implement custom control logic, protocol handling, and glue logic in space-conscious commercial designs.
• I/O-Intensive Interfaces — Leverage 408 I/Os to connect sensors, peripherals, and multiple bus interfaces on a single device.
• Memory-Centric Functions — Use approximately 3.17 Mbits of on-chip RAM for buffering, FIFOs, and temporary data storage in streaming or packet-processing tasks.
• Compact Board Designs — The 676-FBGA (27×27) package enables high-density PCB layouts where surface-mount BGA components are required.

Unique Advantages

• High Logic Capacity: Approximately 74,637 logic elements provide headroom for sizeable custom logic implementations without external logic chips.
• Substantial Embedded Memory: About 3.17 Mbits of on-chip RAM reduces reliance on external memory for many buffering and state-storage needs.
• Extensive I/O Count: 408 I/Os simplify interfacing multiple peripherals and interfaces directly to the FPGA.
• Compact, Serviceable Package: 676-FBGA (27×27) offers a compact footprint suitable for modern PCB assemblies while supporting surface-mount manufacturing.
• Commercial-Grade Specification: Rated for 0 °C to 85 °C operation and RoHS compliance for standard commercial product deployments.
• Predictable Power Requirements: Narrow core voltage range of 1.14 V to 1.26 V aids in power supply selection and system power design.

Why Choose XC6SLX75-N3FGG676C?

The XC6SLX75-N3FGG676C positions itself as a capable commercial-grade FPGA option that balances logic density, embedded memory, and high I/O availability in a compact BGA package. It is suitable for designers building commercial embedded systems, I/O-rich interfaces, and compact board-level solutions that require on-chip RAM and significant programmable logic.

By combining substantial logic resources, ample on-chip memory, and a high pin count in a surface-mount 676-FBGA package, this device supports scalable designs and straightforward integration into existing commercial product development flows.

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