XC6SLX75-N3FGG484C

The XC6SLX75-N3FGG484C is a Spartan®-6 LX field programmable gate array (FPGA) designed for commercial embedded and digital logic applications. It integrates up to 74,637 logic elements, approximately 3.17 Mbits of embedded memory, and supports up to 280 I/Os, providing a balance of logic density and on-chip RAM for moderate-complexity designs.

Packaged for surface-mount assembly in a 484-ball BGA footprint and specified for a 1.14 V to 1.26 V supply range, this device is intended for commercial temperature environments from 0 °C to 85 °C and is RoHS compliant.

Key Features

• Core Logic 74,637 logic elements available to implement custom digital functions and state machines.
• Embedded Memory Approximately 3.17 Mbits of on-chip RAM to support buffering, small data stores, and intermediate processing.
• I/O Density Up to 280 general-purpose I/Os to interface with external peripherals, sensors, and buses.
• Power Supply Supports a core voltage range of 1.14 V to 1.26 V, matching common FPGA core requirements.
• Package & Mounting Surface-mount 484-BBGA package; supplier device package listed as 484-FBGA (23×23) for compact board-level integration.
• Commercial Temperature Grade Rated for operation from 0 °C to 85 °C, suitable for a wide range of commercial applications.
• Compliance RoHS compliant for environmental and regulatory alignment.

Typical Applications

• Embedded Systems — Implement custom control logic and peripheral interfaces using available logic elements and on-chip RAM.
• Prototyping and Development — Validate digital designs and iterate firmware/hardware partitions with flexible programmable logic and abundant I/O.
• Data Handling and Buffering — Use the device's embedded memory for temporary data storage, buffering, and small FIFO implementations.

Unique Advantages

• High Logic Capacity: 74,637 logic elements provide capacity for moderate-complexity designs without discrete consolidation of components.
• Integrated Memory: Approximately 3.17 Mbits of on-chip RAM reduces the need for some external memory, simplifying board design.
• Flexible I/O Count: 280 I/Os enable broad connectivity options for sensors, peripherals, and custom interfaces.
• Compact BGA Packaging: 484-ball BGA footprint (484-FBGA supplier package, 23×23) supports dense board layouts and surface-mount assembly.
• Commercial Temperature Range: Rated for 0 °C to 85 °C to match typical commercial product environments.
• Regulatory Compliance: RoHS compliant for environmentally conscious manufacturing requirements.

Why Choose XC6SLX75-N3FGG484C?

The XC6SLX75-N3FGG484C delivers a practical combination of logic density, embedded memory, and I/O capacity in a surface-mount 484-ball BGA package, making it suitable for commercial embedded designs that require programmable logic and on-chip RAM. Its specified core voltage range and commercial temperature rating align with standard board- and system-level power and thermal plans.

As part of the Spartan®-6 LX family, this device is appropriate for engineering teams seeking a scalable programmable solution that balances integration and board-level footprint while remaining RoHS compliant for manufacturing and supply chain considerations.

Request a quote or submit an inquiry to obtain pricing and availability for the XC6SLX75-N3FGG484C and to discuss how this FPGA can fit into your next design.