XC6SLX75-N3FGG484I

The XC6SLX75-N3FGG484I is an AMD Spartan®-6 LX field programmable gate array supplied in a 484-BBGA package. It couples a large configurable fabric with substantial on-chip memory and a broad I/O footprint to address industrial embedded designs.

With 74,637 logic elements across 5,831 configurable logic blocks (CLBs), approximately 3.17 Mbits of embedded memory and 280 I/Os, this device targets applications requiring flexible logic integration, moderate embedded memory capacity and extended operating temperature support.

Key Features

• Configurable Logic Fabric — 5,831 configurable logic blocks (CLBs) providing 74,637 logic elements for implementing custom digital logic and control functions.
• Embedded Memory — Approximately 3.17 Mbits of on-chip RAM to support buffering, lookup tables and temporary storage within the FPGA fabric.
• I/O Capacity — 280 user-accessible I/Os to interface with sensors, peripherals and external devices in multi-channel designs.
• Power Supply — Core voltage supply range of 1.14 V to 1.26 V for the FPGA core.
• Package & Mounting — 484-BBGA package (supplier device package: 484-FBGA, 23×23) optimized for surface-mount assembly.
• Industrial Temperature Grade — Rated for operation from –40 °C to 100 °C for use in demanding environmental conditions.
• Compliance — RoHS compliant, supporting regulatory requirements for lead-free assembly.

Typical Applications

• Industrial Control — Implement motor control, automation logic and sensor interfacing where industrial temperature range and robust I/O are required.
• Embedded Systems — Integrate custom processing pipelines, peripheral bridging and real-time control functions within compact embedded designs.
• Communications and Networking — Support interface logic, packet parsing or protocol handling using the device's ample logic resources and I/O count.
• Custom Logic and Prototyping — Rapidly iterate and validate hardware-accelerated functions using the Spartan-6 LX configurable fabric.

Unique Advantages

• Substantial Logic Capacity: 74,637 logic elements enable complex state machines, parallel processing and custom datapaths without immediate external logic.
• Meaningful On-Chip Memory: Approximately 3.17 Mbits of embedded RAM reduces dependence on external memory for buffering and lookup functions.
• High I/O Count: 280 I/Os allow flexible connectivity options for multi-sensor, multi-interface or high-channel-count designs.
• Industrial Temperature Range: Rated from –40 °C to 100 °C to support deployments in harsh or temperature-variable environments.
• Compact Surface-Mount Package: 484-BBGA (484-FBGA supplier package, 23×23) delivers a dense footprint suitable for space-constrained PCBs.
• Regulatory Readiness: RoHS compliance supports lead-free manufacturing and environmental requirements.

Why Choose XC6SLX75-N3FGG484I?

The XC6SLX75-N3FGG484I combines a sizable configurable logic fabric with meaningful embedded memory and a high I/O count, making it suitable for industrial and embedded designs that require on-board customization and reliable operation across a wide temperature range. Its surface-mount 484-BBGA package and RoHS compliance simplify integration into modern, space-conscious assemblies.

This part is well suited for engineers and procurement teams building scalable hardware that needs a balance of logic density, local memory and robust I/O, backed by AMD’s Spartan®-6 LX family attributes.

Request a quote or submit a procurement inquiry to obtain pricing and availability for the XC6SLX75-N3FGG484I.