XC6SLX75T-2CSG484I

The XC6SLX75T-2CSG484I is a Spartan®-6 LXT field programmable gate array (FPGA) from AMD in a 484‑FBGA (19×19) CSPBGA package. It delivers a high-density programmable logic fabric with substantial on‑chip memory and a large number of user I/O, tailored for industrial applications that require extended temperature operation and RoHS compliance.

Key capabilities include 74,637 logic elements, approximately 3.17 Mbits of embedded memory, and up to 292 user I/O pins, offering a balance of integration and flexibility for designs that demand logic density, significant memory resources, and broad external connectivity.

Key Features

• Core Architecture Spartan®-6 LXT FPGA fabric providing a high-density programmable logic resource of 74,637 logic elements for custom digital implementation.
• Logic Resources Approximately 74,637 logic elements to implement complex state machines, datapaths, and custom accelerators.
• Embedded Memory Approximately 3.17 Mbits of on‑chip RAM to support buffering, LUT-based storage, and local data processing without external memory.
• I/O Capacity Up to 292 user I/O pins for broad peripheral interfacing, multi‑lane signaling, and flexible board-level connectivity.
• Power Core supply range of 1.14 V to 1.26 V for the programmable logic core.
• Package & Mounting 484‑FBGA (CSPBGA) 19×19 package in a surface-mount form factor suited to compact board designs.
• Industrial Temperature Range Rated for operation from -40°C to 100°C, providing durability for industrial environments.
• Regulatory Compliance RoHS compliant to meet common environmental and manufacturing requirements.

Typical Applications

• Industrial Control and Automation Leverages the -40°C to 100°C operating range and abundant logic and I/O to implement control logic, I/O aggregation, and protocol bridging in industrial equipment.
• High‑Density Logic and Custom Acceleration Uses the 74,637 logic elements and on‑chip memory to implement custom accelerators, signal processing pipelines, and complex state machines.
• Interface and I/O Expansion Employs up to 292 user I/O pins to bridge between sensors, actuators, and higher‑level systems, consolidating multiple interfaces on a single device.

Unique Advantages

• High Logic Density: 74,637 logic elements enable substantial on‑chip digital integration, reducing the need for external CPLDs or discrete logic.
• Significant On‑Chip Memory: Approximately 3.17 Mbits of embedded RAM provides local buffering and data storage to simplify board-level memory architecture.
• Large I/O Count: 292 user I/O pins support complex interfacing and multi‑channel connectivity without additional I/O expanders.
• Industrial Temperature Capability: Rated from -40°C to 100°C for deployment in temperature‑challenging environments where extended-range operation is required.
• Compact Surface‑Mount Package: The 484‑FBGA (19×19) CSPBGA footprint enables high-density PCB integration in space-constrained designs.
• RoHS Compliant: Meets RoHS requirements for environmentally conscious manufacturing and supply chain compliance.

Why Choose XC6SLX75T-2CSG484I?

The XC6SLX75T-2CSG484I combines a Spartan®-6 LXT FPGA fabric with a high logic element count, substantial embedded memory, and a large I/O complement in a compact 484‑FBGA package. Its industrial temperature rating and RoHS compliance make it suitable for long-life, environmentally demanding applications where on‑board integration and flexible I/O are priorities.

This device is well suited for design teams seeking to consolidate logic, memory, and interfaces into a single programmable device, simplifying BOM and enabling field-configurable systems with robust thermal margin and board‑level density.

Request a quote or submit an inquiry to get pricing and availability for XC6SLX75T-2CSG484I and to discuss how it can fit into your next design.