XC6SLX75T-2FGG484I

The XC6SLX75T-2FGG484I is a Spartan®-6 LXT field programmable gate array (FPGA) IC from AMD, supplied in a 484-ball BGA package. It provides a combination of on-chip logic, embedded RAM and a high I/O count tailored for industrial embedded designs.

Key attributes include approximately 74,637 logic elements, roughly 3.17 Mbits of embedded memory, 268 I/O pins, an industrial temperature rating, and a low-voltage core supply range—making it suited to applications that require substantial configurable logic and on-chip resources in a compact surface-mount package.

Key Features

• Core Logic Approximately 74,637 logic elements for implementing complex programmable logic, state machines and custom datapaths.
• Embedded Memory Approximately 3.17 Mbits of on-chip RAM (3,170,304 bits) to support buffering, FIFOs and small memory arrays without external memory.
• I/O Capacity 268 general-purpose I/O pins to interface with a wide range of peripherals, sensors and bus interfaces.
• Power Core supply voltage range of 1.14 V to 1.26 V to match system power rails and enable predictable power budgeting.
• Package & Mounting 484-BBGA package (supplier device package: 484-FBGA, 23 × 23) in a surface-mount form factor for compact board-level integration.
• Industrial Temperature Range Rated for operation from −40 °C to 100 °C, suitable for industrial environments.
• Environmental Compliance RoHS compliant, supporting environmental and regulatory requirements for lead-free assembly.

Typical Applications

• Industrial Control Implement programmable control logic and custom interfaces for factory automation while meeting industrial temperature requirements.
• Embedded Processing Offload application-specific logic and hardware acceleration using the FPGA’s sizable logic element count and on-chip RAM.
• Protocol Bridging & I/O Aggregation Use the 268 I/O pins to concentrate multiple peripheral interfaces and create protocol converters or glue logic.
• Measurement & Instrumentation Implement data capture, preprocessing and buffering on-chip using the embedded RAM and configurable logic for instrumentation front-ends.

Unique Advantages

• High Logic Density: Approximately 74,637 logic elements provide the resources needed for complex custom logic and parallel processing.
• On-Chip Memory: Around 3.17 Mbits of embedded RAM reduces reliance on external memory for many buffering and data-path tasks.
• Generous I/O Count: 268 I/O pins simplify system integration by enabling direct connections to multiple peripherals and buses.
• Industrial Reliability: Rated from −40 °C to 100 °C and available in a surface-mount 484-BBGA package suitable for industrial assemblies.
• Compact Packaging: The 484-FBGA (23 × 23) supplier package minimizes PCB footprint while providing high pin density.
• Regulatory Compliance: RoHS compliance supports lead-free manufacturing requirements.

Why Choose XC6SLX75T-2FGG484I?

The XC6SLX75T-2FGG484I balances substantial programmable logic, embedded memory and high I/O count within a compact 484-BBGA surface-mount package, and is specified for industrial temperature operation. Its combination of resources and package density makes it appropriate for designers needing on-board programmable capability without external memory dependencies.

Choose this Spartan®-6 LXT FPGA when you require scalable logic capacity, on-chip RAM for buffering and preprocessing, and an industrial temperature rating for robust embedded system deployments backed by AMD’s FPGA product lineage.

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