XC6SLX75T-3CSG484C

The XC6SLX75T-3CSG484C is a Spartan®-6 LXT Field Programmable Gate Array (FPGA) in a 484‑FBGA (19×19) CSPBGA surface-mount package from AMD. It delivers 74,637 logic elements, approximately 3.17 Mbits of embedded memory and 292 I/O, making it a compact programmable-logic option for commercial applications.

Key Features

• Logic Capacity — 74,637 logic elements organized across 5,831 CLBs provide substantial programmable logic resources for medium-complexity designs.
• Embedded Memory — Approximately 3.17 Mbits of on-chip RAM to support buffering, data storage and state machines without immediate reliance on external memory.
• I/O — 292 user I/O pins to interface with peripherals, sensors and external logic.
• Power — Core voltage supply range of 1.14 V to 1.26 V to support predictable power planning and supply design.
• Package & Mounting — 484-FBGA (CSPBGA, 19×19) surface-mount package for high-density PCB integration.
• Operating Range & Grade — Commercial-grade device rated for 0 °C to 85 °C operation.
• Environmental Compliance — RoHS compliant.

Unique Advantages

• High logic integration: 74,637 logic elements enable consolidation of multiple functions into a single FPGA, reducing overall system component count.
• On-chip memory for reduced BOM: Approximately 3.17 Mbits of embedded RAM can lower dependence on external memory, simplifying board layout and lowering part count.
• Generous I/O complement: 292 I/O pins provide flexible interfacing options for a wide range of external devices and buses.
• Compact, manufacturable package: 484‑FBGA (19×19) CSPBGA surface-mount package supports dense PCB designs and automated assembly.
• Predictable power planning: Defined core supply range (1.14–1.26 V) aids in regulator selection and thermal/power budgeting.
• Commercial temperature and compliance: Rated for 0 °C to 85 °C operation and RoHS compliant for broad commercial deployments.

Why Choose XC6SLX75T-3CSG484C?

The XC6SLX75T-3CSG484C positions itself as a capable Spartan‑6 LXT FPGA offering a balance of logic density, embedded memory and I/O in a compact 484‑FBGA package. Its specifications suit designs that require significant programmable logic and on‑chip RAM while maintaining a surface-mount, manufacturable footprint.

Supported by AMD as the manufacturer and specified for commercial temperature operation, this device is appropriate for development and production programs that value integration, predictable power requirements and RoHS compliance. It provides a clear hardware platform for engineers seeking a medium-density FPGA solution for a range of commercial electronic designs.

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