XC6SLX75T-3CSG484I

IC FPGA 292 I/O 484CSBGA
Part Description

Spartan®-6 LXT Field Programmable Gate Array (FPGA) IC 292 3170304 74637 484-FBGA, CSPBGA

Quantity 696 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package484-CSPBGA (19x19)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case484-FBGA, CSPBGANumber of I/O292Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs5831Number of Logic Elements/Cells74637
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits3170304

Overview of XC6SLX75T-3CSG484I – Spartan®-6 LXT FPGA (484-CSPBGA)

The XC6SLX75T-3CSG484I is a Spartan®-6 LXT field programmable gate array (FPGA) from AMD, supplied in a 484-pin CSPBGA package. It delivers a balance of programmable logic capacity, embedded memory, and I/O density for industrial embedded designs.

With thousands of configurable logic blocks, approximately 3.17 Mbits of on-chip RAM and 292 I/O pins, this device targets designs that require moderate to high logic integration, flexible I/O, and industrial temperature operation.

Key Features

  • Core Architecture  Spartan‑6 LXT FPGA architecture from AMD in the XC6SLX75T series, provided in a 484‑pin CSPBGA (19×19) package.
  • Logic Capacity  5,831 CLBs and 74,637 logic elements to implement complex combinational and sequential logic functions.
  • Embedded Memory  Approximately 3.17 Mbits of on‑chip RAM suitable for buffering, small FIFOs, and local storage.
  • I/O Density  292 user I/O pins to support multiple parallel interfaces and signal routing across the system.
  • Power  Core voltage supply range of 1.14 V to 1.26 V for predictable power rail planning.
  • Package & Mounting  484‑FBGA / 484‑CSPBGA (19×19) surface‑mount package designed for compact board integration.
  • Operating Range & Grade  Industrial temperature rating from −40°C to 100°C, suitable for a wide range of industrial environments.
  • Environmental Compliance  RoHS compliant for lead‑free manufacturing and regulatory alignment.

Typical Applications

  • Industrial control and automation  Programmable logic and I/O density support control algorithms, glue logic and interface consolidation in industrial equipment.
  • Embedded system prototyping  Logic capacity and on‑chip RAM enable development and testing of custom digital architectures and system integration tasks.
  • I/O‑rich interface implementations  292 I/O pins accommodate parallel sensor arrays, bus interfacing, and multiple peripheral connections.
  • Memory‑buffered data handling  Approximately 3.17 Mbits of embedded memory provides local buffering for packet, frame or sample storage within FPGA logic.

Unique Advantages

  • Significant logic resources: 74,637 logic elements and 5,831 CLBs allow integration of sizeable custom logic blocks on a single device, reducing external logic.
  • Balanced embedded memory: Approximately 3.17 Mbits of on‑chip RAM supports local data storage and reduces external memory requirements.
  • High I/O count: 292 I/O pins simplify board routing for multi‑interface or parallel connections without additional multiplexing hardware.
  • Industrial temperature capability: −40°C to 100°C operating range supports deployment in demanding ambient conditions.
  • Compact surface‑mount package: 484‑CSPBGA (19×19) provides a space‑efficient solution for dense PCBs and compact system form factors.
  • RoHS compliant: Conforms to lead‑free manufacturing requirements for environmental and production planning.

Why Choose XC6SLX75T-3CSG484I?

The XC6SLX75T-3CSG484I combines substantial programmable logic, embedded memory and a high I/O count in a compact 484‑CSPBGA package, making it suitable for engineers who need a flexible FPGA platform for industrial and embedded designs. Its specified core voltage range and industrial temperature rating help simplify power and thermal planning for robust deployments.

Choose this Spartan‑6 LXT device when your design requires integrated logic density, local memory for data buffering, and a large number of external interfaces in a surface‑mount form factor backed by AMD silicon and RoHS compliance.

Request a quote or submit an inquiry to receive pricing and availability information for the XC6SLX75T-3CSG484I.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1969


    Headquarters: Santa Clara, California, USA


    Employees: 25,000+


    Revenue: $22.68 Billion


    Certifications and Memberships: ISO9001:2015, RoHS, REACH


    Featured Products
    Latest News
    keyboard_arrow_up