XC6SLX75T-3FGG484I

The XC6SLX75T-3FGG484I is a Spartan®-6 LXT Field Programmable Gate Array (FPGA) provided in a 484-ball BGA package. It combines a large logic fabric with embedded memory and abundant I/O to support industrial-grade embedded designs.

Key on-chip capacity includes 74,637 logic elements and approximately 3.17 Mbits of embedded memory, while platform-level characteristics such as a 1.14 V to 1.26 V core supply and a −40 °C to 100 °C operating range align the device to industrial application environments.

Key Features

• Logic Capacity  74,637 logic elements for implementing complex combinational and sequential logic functions.
• Embedded Memory  Approximately 3.17 Mbits of total on-chip RAM to support buffering, FIFOs, and temporary storage for datapaths.
• I/O Resources  268 user I/O pins to interface with external devices, sensors, and peripherals.
• Core Power  Core voltage supply range of 1.14 V to 1.26 V for devices and system power planning.
• Package and Mounting  484-ball BBGA package (supplier device package listed as 484-FBGA, 23×23) with surface-mount mounting for compact board-level integration.
• Industrial Temperature Range  Rated for operation from −40 °C to 100 °C to meet industrial environment requirements.
• Environmental Compliance  RoHS compliant to support regulatory requirements for restricted substances.

Unique Advantages

• Substantial logic density: 74,637 logic elements allow implementation of sizable logic subsystems and custom accelerators on a single device, reducing system complexity.
• On‑chip memory for data handling: Approximately 3.17 Mbits of embedded RAM supports local buffering and high-throughput data paths without immediate external memory dependence.
• Ample I/O for system integration: 268 I/Os enable broad connectivity to sensors, actuators, and external interfaces, simplifying board-level routing and partitioning.
• Industrial-ready thermal range: −40 °C to 100 °C operating range provides robustness for industrial deployments and harsh ambient conditions.
• Compact surface-mount BGA packaging: The 484-ball BGA (23×23) format supports dense PCB layouts while maintaining reliable soldered connections for long-term operation.
• Regulatory alignment: RoHS compliance helps streamline product qualification and environmental compliance efforts.

Why Choose XC6SLX75T-3FGG484I?

The XC6SLX75T-3FGG484I positions itself as an industrial-grade Spartan‑6 LXT FPGA option for designs that require significant on-chip logic, embedded memory, and broad I/O in a compact surface-mount BGA footprint. Its combination of 74,637 logic elements, approximately 3.17 Mbits of RAM, and 268 I/Os makes it suitable for embedded systems and industrial applications where integration and thermal resilience are important.

Engineers selecting this part benefit from predictable power and thermal parameters—1.14 V to 1.26 V core supply and −40 °C to 100 °C rating—alongside RoHS compliance, enabling scalable designs with attention to environmental and manufacturing requirements.

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