XC6SLX75T-4FGG484C

The XC6SLX75T-4FGG484C is a Spartan®-6 LXT Field Programmable Gate Array (FPGA) from AMD, delivered in a 484-BBGA package. It integrates approximately 74,637 logic elements, about 3.17 Mbits of embedded memory, and 268 programmable I/O pins for compact, configurable digital designs.

Designed for commercial-grade applications, the device is a surface-mount FPGA with a supply voltage range of 1.14 V to 1.26 V and an operating temperature range of 0 °C to 85 °C. The 484-FBGA (23×23) supplier package provides a dense footprint for space-constrained boards.

Key Features

• Core Logic  Approximately 74,637 logic elements enable implementation of complex combinational and sequential logic functions.
• Embedded Memory  Around 3.17 Mbits of on-chip RAM to store intermediate data, buffers, and state information without external memory.
• I/O Density  268 programmable I/O pins provide extensive external connectivity for peripherals, sensors, and interfaces.
• Power  Narrow supply voltage window from 1.14 V to 1.26 V for the core, allowing predictable power provisioning in system designs.
• Package & Mounting  484-BBGA package (supplier device package: 484-FBGA, 23×23) designed for surface-mount assembly to support compact PCB layouts.
• Temperature & Grade  Commercial-grade device with an operating range of 0 °C to 85 °C for typical commercial electronics environments.
• Environmental Compliance  RoHS compliant to support lead-free manufacturing and environmental requirements.

Typical Applications

• Embedded System Control  Use the device’s logic capacity and I/O count to implement control logic, state machines, and glue logic within commercial embedded systems.
• Protocol Bridging & I/O Expansion  268 I/Os allow implementation of protocol converters, parallel/serial bridging, and interface aggregation on a single FPGA.
• Prototyping and Development  On-chip memory and large logic resources support functional prototyping of digital blocks and subsystem proof-of-concept designs.
• Compact Commercial Appliances  The 484-BBGA surface-mount package fits space-constrained PCBs for compact commercial devices operating within 0 °C to 85 °C.

Unique Advantages

• High Logic Capacity: Approximately 74,637 logic elements let designers consolidate multiple functions into a single device, reducing BOM count.
• Substantial On-Chip Memory: About 3.17 Mbits of embedded RAM simplifies buffering and temporary data storage without external memory.
• Extensive I/O Resources: 268 I/Os enable flexible connectivity options for sensors, peripherals, and multiple interfaces.
• Compact, Surface-Mount Package: The 484-BBGA (484-FBGA, 23×23) package supports dense PCB integration and surface-mount assembly workflows.
• Predictable Power Envelope: A defined core supply range of 1.14 V to 1.26 V helps streamline power-supply design and validation.
• Commercial Temperature & RoHS Compliance: Rated 0 °C to 85 °C and RoHS compliant for standard commercial manufacturing and deployment.

Why Choose XC6SLX75T-4FGG484C?

The XC6SLX75T-4FGG484C positions itself as a commercial-grade Spartan-6 LXT FPGA that combines a substantial logic fabric, meaningful on-chip memory, and a high I/O count in a compact 484-BBGA surface-mount package. These attributes make it well suited for engineers and procurement teams who need a configurable silicon solution with clear, verifiable electrical and thermal parameters.

This device is appropriate for designs that require consolidation of digital functions, local buffering without external memory, and broad peripheral connectivity while operating within a commercial temperature range. Its packaging and RoHS compliance support mainstream manufacturing and compact system layouts.

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