XC6SLX75T-N3FG676C

The XC6SLX75T-N3FG676C is a Spartan®-6 LXT field programmable gate array (FPGA) from AMD provided in a 676-ball BGA package. It combines a high count of logic elements and on-chip memory with a large number of I/O pins to support complex digital designs requiring moderate performance and integration.

Targeted at commercial-grade applications, this device offers a balance of programmable logic capacity, embedded RAM, and I/O density in a surface-mount 676-FBGA (27×27) package, with supply and temperature ranges suited to standard commercial environments.

Key Features

• Logic Capacity — 74,637 logic elements (cells) providing substantial programmable fabric for implementing custom digital logic and datapaths.
• Configurable Logic Blocks (CLBs) — 5,831 CLBs for structured logic allocation and design partitioning.
• Embedded Memory — Approximately 3.17 Mbits of on-chip RAM for FIFOs, buffers, and small data-storage needs within the device.
• I/O Density — 348 user I/O pins to support multi-signal interfaces, parallel buses, and extensive peripheral connectivity.
• Power and Supply — Core supply range from 1.14 V to 1.26 V, enabling predictable power planning for board-level design.
• Package and Mounting — 676-FBGA (27×27) package with surface-mount mounting type for compact PCB integration.
• Operating Range — Commercial-grade operating temperature from 0 °C to 85 °C for standard commercial deployments.
• Compliance — RoHS-compliant, meeting common environmental and regulatory requirements for electronic assembly.

Typical Applications

• Custom Digital Logic and Control — Use the device’s 74,637 logic elements and 5,831 CLBs to implement state machines, protocol handlers, and control logic for embedded systems.
• I/O Aggregation and Interface Bridging — Leverage 348 I/O pins to consolidate multiple peripheral interfaces or bridge between different buses and subsystems.
• On-chip Data Buffering — Approximately 3.17 Mbits of embedded RAM can be applied to buffering, small lookup tables, or temporary storage in data-path designs.

Unique Advantages

• High Logic Density: 74,637 logic elements enable implementation of sizable custom logic without external gate arrays.
• Substantial On-chip Memory: Approximately 3.17 Mbits of embedded RAM reduces dependency on external memory for mid-sized buffering tasks.
• Extensive I/O: 348 I/O pins provide flexibility for multi-channel interfaces and complex interconnect requirements.
• Compact BGA Footprint: 676-FBGA (27×27) package allows a high-pin-count device to be integrated into space-constrained PCBs.
• Commercial Temperature Rating: 0 °C to 85 °C rating aligns with typical commercial product deployments and environmental expectations.
• RoHS Compliant: Supports environmentally conscious manufacturing and assembly processes.

Why Choose XC6SLX75T-N3FG676C?

The XC6SLX75T-N3FG676C positions itself as a commercially graded FPGA solution that combines significant programmable logic, embedded memory, and extensive I/O in a compact 676-FBGA package. Its documented supply voltage range and operating temperature make it straightforward to integrate into standard commercial electronic designs.

This device is well suited for design teams and procurement groups seeking a balanced FPGA with enough logic and memory resources for medium-complexity designs, enabling scalable implementations while maintaining PCB space efficiency and compliance with RoHS requirements.

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