XC6SLX9-2CPG196C

The XC6SLX9-2CPG196C is a Spartan®-6 LX Field Programmable Gate Array (FPGA) manufactured by AMD, provided in a 196-TFBGA (CSBGA) surface-mount package. It delivers a mid-range combination of programmable logic, on-chip memory and I/O density for commercial-grade embedded designs.

With 9,152 logic elements, approximately 0.59 Mbits of embedded memory and 106 user I/O, this device is suited to designs that require moderate logic resources, on-chip RAM and flexible interfacing while operating within a commercial temperature range and a 1.14 V–1.26 V core supply.

Key Features

• Core Logic — 9,152 logic elements provide the programmable resources to implement custom digital functions and state machines.
• Embedded Memory — Approximately 0.59 Mbits of on-chip RAM for data buffering, FIFOs and small lookup tables without external memory.
• I/O — 106 user I/O pins to support multiple peripheral interfaces and board-level connections.
• Power — Core voltage supply range of 1.14 V to 1.26 V to match system power domains.
• Package & Mounting — 196-TFBGA (CSBGA) package; supplier device package listed as 196-CSPBGA (8×8); surface-mount mounting type for compact PCB integration.
• Operating Range & Compliance — Commercial grade operation from 0 °C to 85 °C and RoHS compliant.

Typical Applications

• Embedded control and glue logic — Implement mid-complexity control functions and interface glue logic using the device's logic elements and on-chip memory.
• Prototyping and development platforms — Provide reprogrammable logic capacity and embedded RAM suitable for rapid prototyping of digital designs.
• I/O expansion and protocol bridging — Use the 106 user I/O to adapt or bridge multiple board-level interfaces without large external logic stacks.

Unique Advantages

• Right-sized logic capacity: 9,152 logic elements enable mid-range designs without unnecessary overprovisioning.
• On-chip memory reduces BOM: Approximately 0.59 Mbits of embedded RAM can lower dependence on external memory components.
• Generous I/O count: 106 user I/O supports multiple peripherals and simplifies board-level connectivity.
• Compact surface-mount package: 196-TFBGA (196-CSPBGA 8×8) packaging minimizes PCB area for space-constrained designs.
• Commercial readiness: 0 °C to 85 °C operating range and RoHS compliance align with standard commercial deployment requirements.

Why Choose XC6SLX9-2CPG196C?

The XC6SLX9-2CPG196C positions itself as a practical, mid-range Spartan®-6 LX FPGA option for designers who need a balance of programmable logic, embedded memory and ample I/O in a compact surface-mount package. Its specified core voltage range and commercial temperature rating make it suitable for standard embedded applications that require reconfigurable hardware resources.

Manufactured by AMD and delivered in a 196-TFBGA form factor, this device offers a straightforward path to integrate programmable logic into compact boards while reducing external component count through on-chip RAM and flexible I/O. It is well suited to teams seeking a scalable, reprogrammable solution for development and production in commercial environments.

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