XC6SLX9-2CPG196I

The XC6SLX9-2CPG196I is an AMD Spartan®-6 LX field programmable gate array supplied in a 196-ball TFBGA/CSBGA package. It provides a mid-range logic capacity and embedded memory suitable for programmable digital designs that require a compact, surface-mount solution with industrial temperature capability.

Key Features

• Core Logic Contains 9,152 logic elements for implementing custom digital functions and state machines.
• Embedded Memory Approximately 0.59 Mbits (589,824 bits) of on-chip RAM to support FIFOs, buffers and small lookup tables.
• I/O Resources Up to 106 I/O pins to interface with peripherals, sensors and external logic devices.
• Package & Mounting Supplied in a 196-TFBGA / CSBGA package (supplier package: 196-CSPBGA 8×8) for surface-mount board designs.
• Power Core voltage supply range from 1.14 V to 1.26 V, enabling integration into low-voltage power domains.
• Temperature & Grade Industrial grade device with an operating temperature range of −40 °C to 100 °C for deployment in demanding environments.
• Compliance RoHS compliant to meet common environmental and manufacturing requirements.

Typical Applications

• Embedded control and logic Implement custom control algorithms, protocol handling and glue logic for embedded systems.
• Interface bridging Provide programmable I/O and logic to connect disparate digital interfaces and adapt signals between subsystems.
• Prototyping and development Use as a compact, surface-mount FPGA for proof-of-concept designs and early production runs requiring reprogrammability.

Unique Advantages

• Moderate logic capacity: 9,152 logic elements provide a balanced resource set for mid-sized digital designs without excessive board area.
• Integrated on-chip RAM: Approximately 0.59 Mbits of embedded memory reduces external memory requirements for small data buffering and lookup tables.
• Compact BGA package: The 196-ball TFBGA/CSBGA footprint supports high-density, surface-mount PCB layouts for space-constrained applications.
• Low-voltage core: A nominal core voltage range of 1.14 V to 1.26 V enables compatibility with low-voltage power architectures.
• Industrial temperature rating: Operation from −40 °C to 100 °C supports deployment in a wide range of environmental conditions.
• RoHS compliant: Conforms to common environmental manufacturing requirements.

Why Choose XC6SLX9-2CPG196I?

The XC6SLX9-2CPG196I delivers a practical combination of logic density, embedded memory and I/O count in a compact BGA package, positioned for designers needing a reprogrammable, industrial-grade FPGA. Its voltage and temperature specifications make it suitable for embedded control, interface adaptation and prototype-ready production designs where board space and environmental resilience matter.

Built by AMD and supplied in a standard surface-mount package, this device provides predictable integration into low-voltage systems while reducing external component needs through on-chip memory and programmable logic resources.

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