XC6SLX9-2CSG324I

The XC6SLX9-2CSG324I is an AMD Spartan®-6 LX Field Programmable Gate Array (FPGA) supplied in a 324-pin LFBGA/CSPBGA package. This device provides programmable digital logic with a defined set of on-chip memory and I/O resources for embedded and industrial applications.

With 9,152 logic elements, approximately 0.59 Mbits of embedded memory, and 200 user I/O pins, the device targets designs that require moderate logic capacity, significant I/O, and operation across an industrial temperature range.

Key Features

• Logic Capacity  9,152 logic elements for implementing custom digital functions and moderate-complexity designs.
• Embedded Memory  Approximately 0.59 Mbits of on-chip RAM (589,824 bits) for buffering, lookup tables, and small data storage tasks.
• I/O Count  200 user I/O pins to support multiple external interfaces, sensors, and peripheral connections.
• Power  Specified supply voltage range from 1.14 V to 1.26 V to match system power-rail requirements.
• Package & Mounting  324-pin LFBGA / CSPBGA package (324-CSPBGA, 15×15) designed for surface-mount assembly and compact board layouts.
• Temperature & Grade  Industrial-grade device qualified for operation from −40 °C to 100 °C, suitable for temperature-challenging environments.
• Regulatory Compliance  RoHS compliant.

Typical Applications

• Industrial Control  Programmable logic and 200 I/Os enable implementation of custom control algorithms, I/O aggregation, and sensor interfacing in industrial systems.
• Embedded Systems  Moderate logic capacity and on-chip RAM make the device suitable for embedded digital functions and prototyping of custom hardware accelerators.
• Protocol Bridging and Interfaces  High I/O count supports building interface logic and protocol bridges between different subsystems and peripherals.

Unique Advantages

• Balanced Logic and Memory:  9,152 logic elements paired with approximately 0.59 Mbits of embedded RAM provide a practical balance for many mid-range FPGA tasks without excessive device overhead.
• Extensive I/O Resources:  200 user I/Os simplify system-level integration and reduce the need for external multiplexers or I/O expander components.
• Industrial Temperature Range:  Rated from −40 °C to 100 °C to meet the demands of temperature-sensitive deployments in industrial environments.
• Compact Surface-Mount Package:  324-CSPBGA (15×15) LFBGA package enables high-density board designs while maintaining reliable soldered mounting.
• Low-Voltage Operation:  1.14 V to 1.26 V supply range accommodates modern low-voltage power architectures.
• RoHS Compliance:  Conforms to RoHS requirements for environmentally conscious designs.

Why Choose XC6SLX9-2CSG324I?

The XC6SLX9-2CSG324I delivers a practical combination of logic density, embedded memory, and extensive I/O in a compact 324-pin LFBGA package, tailored for industrial and embedded applications that require programmable digital logic with robust operating range. Its specified supply range and RoHS compliance make it adaptable to a variety of system power and regulatory environments.

This device is well suited for designers seeking a mid-range FPGA option for custom control, interface, and embedded logic implementations where industrial temperature performance and a high I/O count are important considerations. Backed by AMD as the manufacturer, it provides a clear specification set for integration into long-term projects.

Request a quote or submit a pricing inquiry for the XC6SLX9-2CSG324I to check availability and obtain detailed purchasing information.