XC6SLX9-2FTG256C

The XC6SLX9-2FTG256C is an AMD Spartan®-6 LX field programmable gate array (FPGA) in a 256-pin LFBGA package designed for commercial applications. It provides a balanced mix of logic resources, embedded memory, and I/O density suitable for mid-range programmable logic tasks.

Key device parameters include 9,152 logic elements, approximately 0.59 Mbits of embedded RAM, 186 I/Os, a nominal core supply range of 1.14 V to 1.26 V, and an operating temperature range of 0 °C to 85 °C. The device is RoHS compliant and supplied in a surface-mount 256-LBGA (256-FTBGA, 17×17) package.

Key Features

• Core Logic  9,152 logic elements providing mid-range programmable logic capacity for custom digital functions.
• Configurable Logic Blocks (CLBs)  715 CLBs for partitioned logic implementation and design modularity.
• Embedded Memory  Approximately 0.59 Mbits of on-chip RAM available for buffering, state storage, and small data structures.
• Input/Output  186 I/O pins to support a variety of external interfaces and parallel connections.
• Power  Core supply range of 1.14 V to 1.26 V to match FPGA core power requirements.
• Package & Mounting  256-LBGA (supplier package 256-FTBGA, 17×17) in a surface-mount form factor for compact PCB integration.
• Temperature & Grade  Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Environmental Compliance  RoHS compliant to meet common environmental regulations.

Typical Applications

• Commercial Embedded Systems  Provides programmable logic and on-chip RAM for control, glue logic, and custom processing in commercial products.
• Custom I/O and Interface Bridging  186 I/Os enable implementation of custom interface bridging and protocol adaptation between subsystems.
• Sensor and Control Electronics  Logic capacity and I/O count support sensor aggregation, preprocessing, and control tasks within the commercial temperature range.

Unique Advantages

• Balanced Logic Density and I/O  9,152 logic elements combined with 186 I/Os deliver a versatile platform for mid-range FPGA designs.
• On-Chip Memory  Approximately 0.59 Mbits of embedded RAM reduces the need for external memory for small buffers and state machines.
• Compact, High-Density Package  256-LBGA (256-FTBGA, 17×17) supports high-density PCB layouts while remaining surface-mount compatible.
• Commercial Temperature Rating  0 °C to 85 °C rating aligns with a wide range of commercial product requirements.
• Low-Voltage Core  1.14–1.26 V supply range simplifies core power design and integration into modern power architectures.
• RoHS Compliant  Meets environmental compliance standards for regulated markets.

Why Choose XC6SLX9-2FTG256C?

The XC6SLX9-2FTG256C delivers a practical combination of logic resources, embedded memory, and I/O capability in a compact surface-mount 256-LBGA package suitable for commercial-grade designs. Its specification set supports engineers who need a mid-range FPGA for custom logic, interfacing, and control functions within the 0 °C to 85 °C operating range.

For projects that demand a balance of integration, predictable power requirements, and environmental compliance, this Spartan®-6 LX device offers clear, verifiable specifications to guide design and procurement decisions.

Request a quote or submit a pricing inquiry for XC6SLX9-2FTG256C to check availability and receive commercial pricing information.