XC6SLX9-3CPG196C

The XC6SLX9-3CPG196C is a Spartan®-6 LX field programmable gate array (FPGA) manufactured by AMD. This surface-mount FPGA integrates up to 9,152 logic elements, approximately 0.59 Mbits of on-chip RAM, and 106 user I/O in a compact 196-TFBGA package.

Designed for commercial-grade applications, the device operates from a 1.14 V to 1.26 V supply and across an operating temperature range of 0 °C to 85 °C, offering a balanced combination of logic capacity, embedded memory, and I/O density for a range of configurable hardware designs.

Key Features

• Logic Capacity  Provides 9,152 logic elements to implement combinational and sequential digital logic.
• Embedded Memory  Includes 589,824 bits of on-chip RAM (approximately 0.59 Mbits) for buffers, FIFOs, and local storage.
• I/O Resources  Offers 106 user I/O pins to support multiple interfaces and board-level connectivity.
• Power  Operates from a core voltage supply range of 1.14 V to 1.26 V, enabling defined power budgeting for the FPGA core.
• Package & Mounting  Supplied in a 196-TFBGA (CSBGA) package—supplier device package noted as 196-CSPBGA (8×8)—and intended for surface-mount assembly.
• Temperature & Grade  Commercial grade device rated for 0 °C to 85 °C operation.
• Compliance  RoHS compliant.

Typical Applications

• Embedded Control and Glue Logic  Use the device to implement custom control functions and interconnect logic where up to 9,152 logic elements and 106 I/Os are required.
• Prototyping and Proof-of-Concept  The programmable nature and on-chip RAM make it suitable for validating digital designs and early hardware/software integration.
• I/O Expansion and Interface Bridging  With 106 I/Os, the FPGA can serve as an interface bridge or I/O expander between subsystems on compact PCBs.

Unique Advantages

• Right-sized Logic Capacity: 9,152 logic elements provide a practical balance between resources and footprint for small to medium-density designs.
• On-chip Memory Availability: Approximately 0.59 Mbits of embedded RAM reduces dependence on external memory for local buffering and control functions.
• Generous I/O Count: 106 user I/Os enable flexible connectivity for multiple interfaces without immediately requiring external multiplexing.
• Compact BGA Package: The 196-TFBGA (196-CSPBGA, 8×8) package supports space-constrained board layouts while maintaining needed signal density.
• Commercial Grade and RoHS Compliant: Suitable for standard commercial applications with environmental compliance for lead-free manufacturing.
• Defined Power Envelope: Core supply range (1.14 V–1.26 V) aids in predictable power design and system integration.

Why Choose XC6SLX9-3CPG196C?

The XC6SLX9-3CPG196C Spartan®-6 LX FPGA from AMD offers a practical mix of logic resources, embedded RAM, and I/O density in a compact 196-TFBGA surface-mount package. Its measurable specifications—9,152 logic elements, ~0.59 Mbits of on-chip memory, 106 I/O, defined core voltage range, and commercial operating temperature—make it a straightforward choice for teams implementing configurable hardware where those resource levels match design needs.

This part is well suited to engineers and procurement teams looking for a commercially graded, RoHS-compliant FPGA option from a recognized manufacturer for prototyping, control logic, and I/O-rich implementations that require clear, verifiable device parameters.

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