XC6SLX9-3CSG324C

The XC6SLX9-3CSG324C is a Spartan®-6 LX field programmable gate array (FPGA) IC from AMD. It delivers 9,152 logic elements, approximately 0.59 Mbits of embedded RAM, and 200 user I/O in a compact 324-LFBGA (324-CSPBGA, 15×15) surface-mount package.

Designed for commercial-grade applications, this device operates over a 0 °C to 85 °C range and requires a core supply between 1.14 V and 1.26 V. Its combination of logic density, on-chip memory, and I/O capability supports a wide range of configurable digital designs.

Key Features

• Core Logic  9,152 logic elements for implementing custom digital functions and control logic.
• Embedded Memory  Approximately 589,824 bits (≈0.59 Mbits) of on-chip RAM for buffering, FIFOs, and small data stores.
• I/O Count  200 user I/O pins to support multi-signal interfaces and peripheral connectivity.
• Power  Core supply voltage range of 1.14 V to 1.26 V to match system power-rail requirements.
• Package & Mounting  324-LFBGA (324-CSPBGA, 15×15) in a surface-mount BGA footprint for compact PCB integration.
• Temperature & Grade  Commercial operating range of 0 °C to 85 °C; classified as commercial grade.
• Regulatory Compliance  RoHS-compliant manufacturing status.

Typical Applications

• Embedded Systems  Use the 9,152 logic elements and on-chip RAM to implement control logic, protocol handling, or custom acceleration inside embedded products.
• Interface Bridging  200 I/O pins enable flexible signal translation and glue logic between multiple digital peripherals or buses.
• Prototyping & Development  Compact BGA packaging and surface-mount mounting make this FPGA suitable for development boards and evaluation modules where moderate logic and I/O density are required.

Unique Advantages

• Moderate Logic Capacity: 9,152 logic elements provide sufficient resources for medium-complexity digital designs without excessive BOM cost.
• On-Chip Memory: Approximately 0.59 Mbits of embedded RAM reduces the need for external memory for buffering and small data structures.
• High I/O Count: 200 user I/Os simplify connection to sensors, displays, and peripherals, reducing the need for external multiplexing.
• Compact BGA Footprint: 324-LFBGA (15×15) enables a dense PCB layout while supporting surface-mount manufacturing processes.
• Commercial Temperature Range: Rated 0 °C to 85 °C for typical commercial applications and product deployments.
• RoHS-Compliant: Environmentally compliant manufacturing status for regulatory alignment.

Why Choose XC6SLX9-3CSG324C?

The XC6SLX9-3CSG324C positions itself as a balanced solution for designs that require a moderate number of logic elements, on-chip memory, and a generous I/O complement in a compact, surface-mount BGA package. Its commercial-grade temperature range and defined core voltage make it suitable for a broad set of commercial embedded applications.

Engineers and procurement teams will find this FPGA appropriate for projects that demand configurable digital logic with integrated RAM and strong I/O capability while maintaining a compact PCB footprint and RoHS compliance.

Request a quote or submit an inquiry to obtain pricing and availability for the XC6SLX9-3CSG324C.