XC6SLX9-3FTG256C

The XC6SLX9-3FTG256C is a Spartan®-6 LX field programmable gate array from AMD designed for applications requiring moderate logic capacity and on-chip memory. It provides 9,152 logic elements, approximately 0.59 Mbits of embedded memory, and 186 general-purpose I/O, packaged in a 256-ball LBGA for surface-mount assembly. This device is suited to commercial-grade designs operating within a 0 °C to 85 °C range and a core supply of 1.14 V to 1.26 V.

Key Features

• Logic Capacity — 9,152 logic elements for implementing custom digital logic and finite-state machines.
• Embedded Memory — Approximately 0.59 Mbits of on-chip RAM for buffering, FIFOs, and small data storage.
• I/O Count — 186 I/O pins to support multiple external interfaces and peripheral connections.
• Power Supply — Core voltage range of 1.14 V to 1.26 V to match system power domains requiring low-voltage FPGA cores.
• Package and Mounting — 256-ball LBGA (supplier package: 256-FTBGA, 17×17) in a surface-mount format for compact board integration.
• Operating Range — Commercial temperature grade with specified operation from 0 °C to 85 °C.
• Environmental Compliance — RoHS compliant to meet common environmental requirements.

Typical Applications

• Custom logic and prototyping — Use the 9,152 logic elements to implement bespoke digital functions or to prototype system logic before ASIC implementation.
• Embedded memory buffering — Approximately 0.59 Mbits of embedded RAM supports local buffering and FIFO implementations for data flow management.
• I/O expansion and interface bridging — 186 I/Os enable the device to act as a flexible bridge or aggregator for multiple peripherals and interfaces.

Unique Advantages

• Right-sized logic capacity: 9,152 logic elements offer a balance of resources for mid-range logic implementations without excess cost or footprint.
• On-chip memory availability: Approximately 0.59 Mbits of embedded RAM reduces the need for external memory in many buffering and small-data applications.
• High I/O count: 186 I/Os provide flexible connectivity options for multi-peripheral systems and complex I/O routing.
• Compact, manufacturable package: 256-ball LBGA (256-FTBGA, 17×17) supports surface-mount assembly in space-constrained designs.
• Low-voltage core operation: 1.14 V to 1.26 V core supply supports integration into modern low-voltage power architectures.
• Commercial temperature rating and RoHS compliance: Suitable for standard commercial deployments while meeting environmental compliance requirements.

Why Choose XC6SLX9-3FTG256C?

The XC6SLX9-3FTG256C positions itself as a practical FPGA choice for commercial applications that require moderate logic density, on-chip memory, and substantial I/O capability in a compact package. Backed by the Spartan®-6 LX family from AMD, it provides clearly specified core voltage and temperature ranges that simplify system-level power and thermal planning.

This device is ideal for designers seeking a balanced FPGA solution for custom logic, interface bridging, and local buffering without moving to larger, more complex devices. Its combination of logic elements, embedded memory, I/O count, and compact LBGA packaging delivers long-term value for mid-range embedded designs.

Request a quote or submit an inquiry today to evaluate the XC6SLX9-3FTG256C for your design needs.