XC6SLX9-L1CPG196I

The XC6SLX9-L1CPG196I is a Spartan®-6 LX Field Programmable Gate Array (FPGA) IC from AMD designed for industrial applications. It provides a balance of programmable logic capacity, embedded RAM, and I/O in a compact surface-mount BGA package.

With 9,152 logic elements, approximately 0.59 Mbits of on-chip RAM, 106 I/O pins, and an operating range from -40 °C to 100 °C, this device is suited for designs that require deterministic programmable logic, moderate embedded memory, and a robust industrial temperature envelope.

Key Features

• Logic Capacity — 9,152 logic elements (cells) provide the programmable fabric for custom digital logic and control functions.
• Embedded Memory — Approximately 0.59 Mbits of total RAM bits for buffering, FIFOs, and small data stores within the FPGA fabric.
• I/O Resources — 106 available I/O pins to support peripheral interfaces, sensor connections, and board-level signaling.
• Power Supply — Operates from a core voltage supply range of 1.14 V to 1.26 V to match system-level power design constraints.
• Package & Mounting — 196-TFBGA (CSBGA) surface-mount package; supplier device package listed as 196-CSPBGA (8×8) for compact board footprints.
• Temperature Grade — Industrial operating temperature range from -40 °C to 100 °C for deployment in temperature-challenging environments.
• Environmental Compliance — RoHS compliant.

Typical Applications

• Industrial Control and Automation — Implement custom control logic and real-time decision making using the device’s logic resources and industrial temperature rating.
• Embedded Systems and Prototyping — Use the FPGA fabric and on-chip RAM to develop and validate embedded functions and custom peripherals.
• I/O Bridging and Protocol Conversion — Leverage 106 I/O pins to interface between sensors, actuators, and system buses or to implement protocol bridging logic.
• Data Acquisition and Preprocessing — Employ on-chip memory and programmable logic to buffer and preprocess sensor data before transfer to host processors.

Unique Advantages

• Balanced Logic and Memory — 9,152 logic elements combined with approximately 0.59 Mbits of embedded RAM enable a wide range of mid-density logic implementations without external memory for small buffers.
• Industrial Temperature Rating — Specified operation from -40 °C to 100 °C supports deployment in industrial and temperature-variable environments.
• Compact BGA Packaging — 196-TFBGA/196-CSPBGA (8×8) package reduces PCB area while offering high pin density for complex I/O routing.
• Defined Power Envelope — Core voltage supply of 1.14 V to 1.26 V provides a clear power-design target for system integration.
• RoHS Compliant — Meets environmental compliance requirements for lead-free assembly processes.
• Manufacturer-backed Device — Part of AMD’s Spartan®-6 family, providing a known manufacturer pedigree for sourcing and lifecycle considerations.

Why Choose XC6SLX9-L1CPG196I?

The XC6SLX9-L1CPG196I positions itself as a practical, industrial-grade FPGA option when you need mid-density programmable logic, embedded memory, and a robust operating temperature range in a compact BGA form factor. Its combination of 9,152 logic elements, approximately 0.59 Mbits of on-chip RAM, and 106 I/O pins makes it suitable for industrial control, embedded processing, I/O bridging, and data-preprocessing tasks.

Choose this device when your design requires a deterministic, board-level programmable solution with clear electrical and thermal specifications, RoHS compliance, and the package density to save PCB area while maintaining necessary connectivity.

Request a quote or submit a pricing inquiry for XC6SLX9-L1CPG196I to check availability and receive tailored procurement and delivery information.