XC6SLX9-L1CSG324I

The XC6SLX9-L1CSG324I is a Spartan®-6 LX Field Programmable Gate Array (FPGA) IC from AMD supplied in a 324-pin CSPBGA package. It provides 9,152 logic elements, approximately 0.59 Mbits of embedded memory, and up to 200 user I/Os, making it suitable for compact, I/O-rich designs.

Designed for industrial use, this surface-mount FPGA operates over a wide temperature range and low-voltage supply range, delivering a balance of integration and environmental robustness for board-level implementations.

Key Features

• Logic Capacity — 9,152 logic elements to implement combinational and sequential logic for custom digital functions.
• Embedded Memory — Approximately 0.59 Mbits of on-chip RAM to support buffers, FIFOs, and temporary data storage.
• I/O Count — 200 available user I/Os to support multiple interfaces and external peripherals.
• Power Supply — Operates from a core voltage supply range of 1.14 V to 1.26 V, enabling low-voltage system designs.
• Package & Mounting — 324-CSPBGA (15×15) package, surface-mount mounting for compact PCB layouts.
• Industrial Temperature Range — Rated for operation from −40 °C to 100 °C for deployment in temperature-challenging environments.
• RoHS Compliance — RoHS-compliant device to meet standard environmental requirements.

Typical Applications

• Industrial Control Systems — Use the industrial-grade operating range and 200 I/Os for sensor interfacing, protocol bridging, and factory automation logic.
• I/O-Intensive Embedded Devices — Leverage the high I/O count and on-chip memory for board-level designs that require multiple peripheral connections and local buffering.
• Compact Board-Level Integration — The 324-CSPBGA (15×15) surface-mount package supports dense PCB layouts where space and I/O density are priorities.

Unique Advantages

• Balanced Logic and Memory: 9,152 logic elements combined with approximately 0.59 Mbits of embedded RAM provide on-chip resources for mid-range digital designs without external memory.
• High I/O Capacity: 200 user I/Os accommodate multiple interfaces and peripherals, reducing the need for external I/O expanders.
• Industrial Robustness: Rated for −40 °C to 100 °C operation to support deployment in demanding ambient conditions.
• Low-Voltage Core: Core supply range of 1.14 V to 1.26 V supports low-voltage system architectures.
• Compact Surface-Mount Package: The 324-CSPBGA (15×15) format allows dense placement and reliable surface-mount assembly.
• Regulatory Compliance: RoHS compliance supports environmentally conscious product designs.

Why Choose XC6SLX9-L1CSG324I?

The XC6SLX9-L1CSG324I offers a practical combination of logic capacity, embedded memory, and extensive I/O in a compact CSPBGA package tailored for industrial applications. Its specified operating temperature range and RoHS compliance make it suitable for designers focused on durable, board-level FPGA implementations.

This device is a fit for engineering teams building mid-range programmable logic solutions that require a balance of integration, I/O density, and environmental endurance, while maintaining compact board real estate and low-voltage operation.

Request a quote or submit a purchase inquiry to obtain pricing and availability for the XC6SLX9-L1CSG324I.