XC6SLX9-L1FTG256C

The XC6SLX9-L1FTG256C is a commercial-grade Spartan®-6 LX field programmable gate array from AMD. It delivers mid-range programmable logic capacity and on-chip memory in a compact surface-mount 256-LBGA package for commercial embedded designs.

Designed for applications that require a balance of logic, memory and I/O, this device provides 9,152 logic elements, approximately 0.59 Mbits of embedded RAM, and 186 I/O pins, with a core supply range of 1.14 V to 1.26 V and an operating temperature range of 0 °C to 85 °C.

Key Features

• Core Logic — 9,152 logic elements provide mid-range programmable logic capacity for glue logic, control paths and custom processing blocks.
• Embedded Memory — Approximately 0.59 Mbits (589,824 bits) of on-chip RAM supports data buffering, small FIFOs and local storage without external memory.
• I/O — 186 general-purpose I/O pins enable dense interfacing to peripherals, sensors and external devices.
• Power — Core supply voltage range of 1.14 V to 1.26 V for the device’s internal power domain.
• Package & Mounting — 256-LBGA package (supplier device package: 256-FTBGA, 17×17) in a surface-mount format suited to compact PCB designs.
• Operating Range — Commercial operating temperature from 0 °C to 85 °C for standard commercial environments.
• Compliance — RoHS compliant for lead-free manufacturing and restricted-substances requirements.

Typical Applications

• Commercial embedded systems — Implement control logic, protocol handling and customizable digital functions using the device’s 9,152 logic elements and embedded RAM.
• High-density I/O interfacing — Use the 186 I/O pins for bridging, protocol conversion and interconnect tasks without extensive external glue logic.
• Prototyping and development — Mid-range logic and memory capacity make this FPGA suitable for validating designs and building proof-of-concept hardware in commercial projects.

Unique Advantages

• Balanced logic and memory: 9,152 logic elements paired with approximately 0.59 Mbits of embedded RAM provide a practical mix for mid-size designs.
• High I/O count: 186 I/Os reduce the need for additional I/O expansion components, simplifying board-level design.
• Compact surface-mount package: The 256-LBGA / 256-FTBGA (17×17) package supports space-constrained PCBs while maintaining a high pin count.
• Low-voltage core operation: Core supply between 1.14 V and 1.26 V aligns with low-voltage design domains.
• Commercial-grade rating: Rated for 0 °C to 85 °C to match standard commercial deployment environments.
• RoHS compliance: Meets lead-free and restricted substances requirements for manufacturing and regulatory alignment.

Why Choose XC6SLX9-L1FTG256C?

The XC6SLX9-L1FTG256C positions itself as a practical choice for commercial embedded designs that require a balanced combination of logic capacity, on-chip memory and a high I/O count in a compact package. Its specifications support a range of mid-size programmable tasks where board space, I/O density and moderate embedded memory are key considerations.

Manufactured by AMD and supplied in a surface-mount 256-LBGA package, this FPGA is suited to developers and OEMs building commercial products that need reliable, RoHS-compliant programmable logic with clearly defined voltage and temperature operating ranges.

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