XC6SLX9-N3CSG225C

The XC6SLX9-N3CSG225C is a Spartan®-6 LX field programmable gate array (FPGA) IC from AMD. It provides a balance of configurable logic, embedded memory and I/O density in a compact 225-LFBGA (CSPBGA) package for commercial electronic designs.

Key on-chip resources include 9,152 logic elements, approximately 0.59 Mbits of embedded memory, and 160 general-purpose I/Os, making the device suitable for a variety of custom digital functions where mid-range logic capacity and I/O integration are required.

Key Features

• Configurable Logic 9,152 logic elements provide a mid-range fabric for implementing custom digital logic and finite-state control.
• Embedded Memory Approximately 0.59 Mbits of total on-chip RAM bits to support buffering, FIFOs and small data structures within the FPGA fabric.
• I/O Density 160 user I/Os enable integration with multiple peripherals, buses and sensors without external I/O expanders.
• Power and Core Voltage Core supply voltage range of 1.14 V to 1.26 V for the device core power domain.
• Package and Mounting Supplied in a compact 225-LFBGA / 225-CSPBGA (13×13) package with surface-mount mounting for board-level integration.
• Operating Range and Grade Commercial-grade device rated for operation from 0 °C to 85 °C.
• Environmental Compliance RoHS compliant to support regulatory requirements for lead-free manufacturing.

Typical Applications

• Embedded Control and Glue Logic Use the configurable fabric and I/O count to implement custom control logic, protocol bridges or system glue functions in commercial electronics.
• Prototyping and Development Mid-range logic capacity and on-chip memory make the device suitable for prototyping digital designs and validating interfaces.
• I/O Aggregation and Peripheral Management 160 I/Os support aggregation of multiple sensors, actuators and peripheral buses for compact system designs.

Unique Advantages

• Right-sized Logic Capacity: 9,152 logic elements deliver mid-range programmable resources for many custom digital tasks without excessive device overhead.
• On-chip Memory: Approximately 0.59 Mbits of embedded RAM reduces dependence on external memory for small buffering and data handling needs.
• Generous I/O Count: 160 I/Os simplify board-level routing and peripheral connectivity, lowering bill-of-materials for external interface components.
• Compact Surface-Mount Package: 225-LFBGA/225-CSPBGA (13×13) package supports dense PCB layouts and space-constrained applications.
• Commercial Temperature and RoHS Compliance: Rated for 0 °C to 85 °C and RoHS compliant for standard commercial product deployments.
• Low-voltage Core: 1.14 V to 1.26 V core supply range aligns with common FPGA power architectures to simplify power delivery design.

Why Choose XC6SLX9-N3CSG225C?

The XC6SLX9-N3CSG225C offers a balanced combination of configurable logic, embedded memory and I/O capacity in a compact surface-mount 225-LFBGA package. Its specifications—9,152 logic elements, approximately 0.59 Mbits of on-chip RAM, 160 I/Os, and a commercial operating temperature range—make it well suited to commercial embedded designs that require mid-range programmable resources and flexible interfacing.

Manufactured by AMD and provided in a RoHS-compliant package, this FPGA targets designers who need scalable, reconfigurable logic with integrated memory and a robust I/O count for streamlined system integration.

Request a quote or submit a parts inquiry to obtain pricing, availability and delivery options for the XC6SLX9-N3CSG225C.