XC6SLX9-N3FT256C

The XC6SLX9-N3FT256C is a Spartan®-6 LX field programmable gate array (FPGA) provided in a 256-ball BGA package. It delivers 9,152 logic elements, approximately 0.59 Mbits of embedded memory, and 186 general-purpose I/O pins for flexible, programmable digital logic integration.

Designed as a commercial-grade FPGA, the device is RoHS compliant and specified to operate from a 1.14 V to 1.26 V supply across a 0 °C to 85 °C temperature range. The device is supplied in a 256-LBGA package form with a supplier device package listed as 256-FTBGA (17×17).

Key Features

• Core Logic Capacity  Provides 9,152 logic elements to implement custom digital functions and glue logic within a single FPGA device.
• Embedded Memory  Approximately 0.59 Mbits of on-chip RAM for buffering, state machines, and small data storage requirements.
• I/O Resources  186 I/O pins to support multiple external interfaces and parallel connectivity to peripherals and subsystems.
• Package and Mounting  Supplied in a 256-LBGA package; supplier device package noted as 256-FTBGA (17×17). Surface-mount device suitable for standard PCB assembly.
• Power  Operates from a core supply range of 1.14 V to 1.26 V, enabling integration into designs with regulated core rails.
• Commercial Temperature Grade  Specified for operation from 0 °C to 85 °C to meet typical commercial electronics thermal requirements.
• Environmental Compliance  RoHS compliant for reduced hazardous substance content.

Typical Applications

• Custom digital logic  Implement state machines, control logic, and application-specific processing using the device's 9,152 logic elements and on-chip memory.
• Interface bridging and protocol translation  Use the 186 I/O pins to connect and translate between different peripheral standards and bus interfaces.
• Data buffering and small FIFO storage  Leverage approximately 0.59 Mbits of embedded RAM for temporary data storage and buffering in signal processing or communication paths.
• Embedded system control  Integrate control and monitoring functions in commercial electronic products that operate within a 0 °C to 85 °C range.

Unique Advantages

• Configurable logic density:  9,152 logic elements enable a broad range of custom digital implementations without external ASIC development.
• On-chip memory for buffering:  Approximately 0.59 Mbits of embedded RAM supports local data storage needs and reduces external memory dependency.
• High I/O count:  186 I/Os provide flexibility to interface with multiple peripherals, sensors, and external buses.
• Compact BGA package:  256-ball BGA packaging (supplier: 256-FTBGA 17×17) allows dense PCB integration while keeping board footprint modest.
• Commercial-ready operation:  Specified 0 °C to 85 °C temperature range and RoHS compliance align with standard commercial electronics requirements.
• Stable core supply window:  1.14 V to 1.26 V core supply range supports consistent power budgeting in system designs.

Why Choose XC6SLX9-N3FT256C?

The XC6SLX9-N3FT256C positions itself as a flexible, commercial-grade Spartan®-6 LX FPGA suitable for designers who need a balance of logic capacity, embedded memory and I/O resources in a compact surface-mount package. Its combination of 9,152 logic elements, approximately 0.59 Mbits of on-chip RAM, and 186 I/Os makes it well suited to integrate custom logic, interface bridging, and localized data buffering within commercial electronic products.

Choosing this FPGA provides scalability for evolving designs while keeping BOM complexity manageable. Its package options and RoHS compliance support production-ready hardware development for a range of commercial applications.

Request a quote or submit an inquiry to receive pricing and availability information for XC6SLX9-N3FT256C and support for integrating this FPGA into your next design.