XC6SLX9-N3FT256I

The XC6SLX9-N3FT256I is a Spartan-6 LX field programmable gate array (FPGA) from AMD designed for industrial-grade embedded designs. It provides a balanced combination of logic capacity, embedded memory, and I/O connectivity in a compact 256-ball BGA package.

With 9,152 logic elements and approximately 0.59 Mbits of on-chip RAM, this device targets industrial and embedded applications that require deterministic I/O, moderate on-chip storage, and reliable operation across a wide temperature range.

Key Features

• Logic Capacity 9,152 logic elements (logic cells) to implement custom digital functions and state machines.
• Embedded Memory Approximately 0.59 Mbits of total on-chip RAM (589,824 bits) for buffering, FIFOs, and small data stores.
• I/O Resources 186 user I/O pins to support multiple peripheral interfaces and board-level connectivity.
• Power Supply Operates from a core supply range of 1.14 V to 1.26 V for core power planning and regulator selection.
• Industrial Temperature Range Specified for operation from −40 °C to 100 °C, suitable for industrial environments.
• Package and Mounting 256-LBGA package (supplier device package: 256-FTBGA, 17×17) in a surface-mount form factor for compact PCB implementation.
• RoHS Compliant Environmental compliance for lead-free manufacturing and assembly processes.

Typical Applications

• Industrial Control Implement custom control logic, timing, and interfacing for PLCs, motor drives, and factory automation systems.
• Embedded Processing Offload glue logic, protocol bridging, or simple hardware acceleration in embedded systems with moderate logic and memory needs.
• Instrumentation & Test Use on-board logic and I/O to aggregate sensor data, implement real-time processing, or handle custom measurement interfaces.
• Communications Interfaces Implement protocol translators, parallel/serial bridging, or I/O conditioning for communications endpoints.

Unique Advantages

• Balanced Logic and Memory: 9,152 logic elements paired with approximately 0.59 Mbits of embedded RAM provide the resources needed for diverse digital functions without excessive board-level complexity.
• Generous I/O Count: 186 I/Os enable flexible connections to sensors, peripherals, and external devices, reducing the need for secondary interface chips.
• Industrial-Grade Operation: Specified −40 °C to 100 °C operation supports deployment in demanding industrial environments.
• Compact, Surface-Mount Package: 256-LBGA (256-FTBGA, 17×17) delivers a small board footprint for space-constrained designs while maintaining routing density.
• Low-Level Core Voltage Range: Defined 1.14 V to 1.26 V supply window aids in precise power budgeting and regulator selection for system designs.
• RoHS Compliant: Supports lead-free manufacturing and regulatory environmental requirements.

Why Choose XC6SLX9-N3FT256I?

The XC6SLX9-N3FT256I positions itself as a practical FPGA choice for industrial and embedded applications that require a moderate amount of programmable logic, embedded memory, and a high I/O count in a compact package. Its industrial temperature rating and RoHS compliance make it suitable for production environments where reliability and regulatory conformance matter.

Engineers specifying this device benefit from a clear set of hardware capabilities—9,152 logic elements, ~0.59 Mbits of on-chip RAM, 186 I/Os, and a 256-ball BGA footprint—making it straightforward to evaluate for board-level integration and power/thermal design under the stated operating conditions.

Request a quote or submit a procurement inquiry to obtain pricing, availability, and lead-time details for the XC6SLX9-N3FT256I.