XC6VCX130T-1FFG484I

The XC6VCX130T-1FFG484I is a Virtex‑6 CXT field programmable gate array from AMD designed for high‑density digital designs. It combines a large logic capacity with substantial on‑chip memory and a broad I/O count to support complex, I/O‑rich implementations.

Key electrical and environmental characteristics include an operating supply range of 0.95 V to 1.05 V and an industrial operating temperature range of −40 °C to 100 °C, packaged in a 484‑ball BGA (23 × 23) surface‑mount footprint.

Key Features

• Logic Capacity — 128,000 logic elements to support large, compute‑heavy designs and complex digital functions.
• Embedded Memory — Approximately 9.7 Mbits of on‑chip RAM for buffering, packet storage, or intermediate data working sets.
• I/O Resources — 240 I/O pins enabling connectivity to numerous peripherals, interfaces, and external memory devices.
• Core Voltage — Operates from 0.95 V to 1.05 V, providing defined supply requirements for system power design.
• Industrial Temperature Range — Rated for −40 °C to 100 °C operation, suitable for industrial environments.
• Package and Mounting — 484‑ball FBGA (23 × 23) surface‑mount package for high‑density PCB integration.
• RoHS Compliant — Conforms to RoHS requirements for environmental compliance.

Typical Applications

• High‑density digital systems — Use the device’s large logic array and embedded RAM to implement complex processing pipelines and custom accelerators.
• I/O‑intensive interfaces — Leverage 240 I/O pins for multi‑lane connectivity, protocol bridging, and peripheral aggregation.
• Industrial control and automation — Industrial temperature rating and robust packaging support deployment in factory and process control equipment.
• Embedded platform prototyping — Suitable for development of scalable FPGA‑based prototypes where significant logic and memory resources are required.

Unique Advantages

• Substantial logic resources: 128,000 logic elements enable consolidation of multiple functions into a single device, reducing system component count.
• Significant on‑chip memory: Approximately 9.7 Mbits of embedded RAM provide local storage for data buffering and algorithmic state without external memory.
• High I/O density: 240 I/O pins allow flexible interfacing to a wide range of external devices and buses.
• Industrial temperature capability: Rated for −40 °C to 100 °C to meet the demands of industrial deployments.
• Compact, manufacturable package: 484‑ball FBGA (23 × 23) surface‑mount package supports high‑density PCB layouts for space‑constrained designs.
• Regulatory compliance: RoHS compliance supports deployment in environmentally regulated products.

Why Choose XC6VCX130T-1FFG484I?

The XC6VCX130T-1FFG484I provides a balance of high logic capacity, substantial embedded memory, and plentiful I/O in a compact 484‑ball BGA package. Its defined core voltage and industrial temperature rating make it suitable for engineers seeking a robust FPGA platform for complex, I/O‑heavy applications.

As a member of the Virtex‑6 family from AMD, this device is positioned for designs that require large programmable fabric and embedded memory while maintaining manufacturable packaging and environmental compliance. It is well suited to teams that need scalable logic resources and reliable operation across industrial temperature ranges.

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