XC6VCX130T-1FFG784C
| Part Description |
Virtex®-6 CXT Field Programmable Gate Array (FPGA) IC 400 9732096 128000 784-BBGA, FCBGA |
|---|---|
| Quantity | 734 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 784-FCBGA (29x29) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 784-BBGA, FCBGA | Number of I/O | 400 | Voltage | 950 mV - 1.05 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 10000 | Number of Logic Elements/Cells | 128000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 9732096 |
Overview of XC6VCX130T-1FFG784C – Virtex®-6 CXT FPGA, 128,000 Logic Elements, ~9.73 Mbits RAM
The XC6VCX130T-1FFG784C is a Virtex-6 CXT field programmable gate array (FPGA) from AMD designed for complex digital logic integration. It provides a high logic capacity architecture with on-chip embedded memory and a large I/O complement in a 784‑ball FCBGA package for surface-mount applications.
This commercial-grade device targets designs that require substantial programmable logic, significant embedded RAM, and a broad set of I/O while operating within standard commercial temperature and core voltage ranges.
Key Features
- Logic Capacity — 128,000 logic elements and 10,000 CLBs provide substantial programmable logic resources for complex designs.
- Embedded Memory — Approximately 9.73 Mbits of on-chip RAM to support data buffering, FIFOs, and local storage without external memory.
- I/O and Packaging — 400 user I/Os in a 784‑ball FCBGA (29 × 29) package, surface-mount mounting for high-density board designs.
- Power — Core voltage supply range of 950 mV to 1.05 V to match specified power rails for the device.
- Thermal and Grade — Commercial grade with an operating temperature range of 0 °C to 85 °C.
- Environmental Compliance — RoHS compliant for regulatory alignment in assembled products.
Unique Advantages
- High logic density: 128,000 logic elements enable integration of large digital functions and parallel processing blocks on a single device.
- Substantial on-chip memory: Approximately 9.73 Mbits of embedded RAM reduces dependence on external memory components and simplifies board-level design.
- Extensive I/O count: 400 I/Os allow rich interfacing options for multi-channel systems and complex peripheral integration.
- Compact, manufacturable package: 784‑ball FCBGA (29 × 29) surface-mount package supports high-density PCB layouts and automated assembly.
- Commercial temperature support: Rated 0 °C to 85 °C to match typical commercial electronic product environments.
- Regulatory readiness: RoHS compliance helps streamline environmental requirements for product deployment.
Why Choose XC6VCX130T-1FFG784C?
The XC6VCX130T-1FFG784C balances large programmable logic capacity, significant embedded memory, and a high I/O count in a compact FCBGA package, making it suitable for demanding commercial applications that require integration and board-level density. Its specified core voltage range and commercial temperature rating provide clear integration parameters for power and thermal design.
Designed and supplied by AMD, this Virtex-6 CXT FPGA offers a deterministic feature set for engineers and procurement teams seeking a high-capacity, RoHS-compliant FPGA option that aligns with established commercial design constraints.
Request a quote or contact sales to obtain pricing, availability, and integration support for the XC6VCX130T-1FFG784C.
Date Founded: 1969
Headquarters: Santa Clara, California, USA
Employees: 25,000+
Revenue: $22.68 Billion
Certifications and Memberships: ISO9001:2015, RoHS, REACH
