XC6VCX195T-1FFG1156I

The XC6VCX195T-1FFG1156I is a Virtex®-6 CXT field programmable gate array (FPGA) IC from AMD. It provides a high logic capacity FPGA fabric with a substantial amount of on‑chip memory and a large I/O complement in a 1156‑ball FCBGA package.

With 199,680 logic elements, approximately 12.7 Mbits of embedded memory, and 600 I/O, this device targets designs that require dense programmable logic, significant embedded RAM, and extensive external connectivity within an industrial temperature range.

Key Features

• Core Logic 199,680 logic elements provide a high-capacity programmable fabric for complex logic implementations and system integration tasks.
• Embedded Memory Approximately 12.7 Mbits of on-chip RAM to support data buffering, state machines, and embedded storage without external memory for many functions.
• I/O Resources 600 dedicated I/O pins to accommodate wide data buses, multiple interfaces, and mixed-signal front-end connections.
• Power Core supply voltage range of 950 mV to 1.05 V to match platform power delivery and design requirements.
• Package 1156‑BBGA / 1156‑FCBGA (35×35) package for surface-mount board integration where a high-density BGA is required.
• Temperature & Grade Industrial grade device with an operating temperature range of −40 °C to 100 °C for use in extended-temperature applications.
• Compliance RoHS compliant.

Typical Applications

• High-density digital logic — Implement complex, large-scale logic functions that require nearly 200k logic elements and significant on-chip RAM.
• I/O‑intensive interfaces — Bridge multiple high-pin-count interfaces or aggregate data from many peripherals using 600 I/O.
• Industrial control systems — Deploy in systems that benefit from industrial-grade temperature support (−40 °C to 100 °C) and robust packaging.
• Embedded memory‑centric designs — Use the approximately 12.7 Mbits of embedded RAM for buffering, look‑up tables, and packet processing functions.

Unique Advantages

• High logic capacity: 199,680 logic elements allow consolidation of multiple functions into a single FPGA, reducing system complexity.
• Substantial on‑chip memory: Approximately 12.7 Mbits of embedded RAM minimizes dependence on external memory for many workloads.
• Extensive I/O count: 600 I/O pins support broad interfacing options and parallel data paths for higher throughput designs.
• Industrial temperature capability: Rated for −40 °C to 100 °C operation to meet extended-environment requirements.
• Compact BGA package: 1156‑FCBGA (35×35) package enables board-level density while providing a robust surface-mount mounting type.
• Low-voltage core: Core supply range of 950 mV to 1.05 V aligns with modern low-voltage power architectures.

Why Choose XC6VCX195T-1FFG1156I?

The XC6VCX195T-1FFG1156I is positioned for designs that require a combination of high logic capacity, ample embedded memory, and extensive I/O in a compact BGA package. Its industrial operating range and RoHS compliance make it suitable for applications that demand robust environmental performance and regulatory alignment.

This AMD Virtex®-6 CXT device is appropriate for engineers consolidating functions into a single FPGA, implementing memory-intensive algorithms on-chip, or building systems that require large I/O counts. The combination of specifications supports scalability and integration in complex embedded and control systems.

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