XC6VCX195T-2FF784I

The XC6VCX195T-2FF784I is a Virtex®-6 CXT field programmable gate array (FPGA) from AMD, supplied in a 784-FCBGA (29×29) package. It provides high logic capacity and significant on-chip embedded memory alongside a broad I/O set, making it suitable for industrial embedded designs that require dense programmable logic and robust thermal tolerance.

Key Features

• Logic Capacity 199,680 logic elements provide substantial programmable resource for complex digital designs.
• Embedded Memory Approximately 12.68 Mbits of on-chip RAM to support buffering, state storage, and datapath implementations.
• I/O Density Up to 400 I/O pins to interface with multiple peripherals, sensors, and external devices.
• Power Core voltage supply range of 0.95 V to 1.05 V for the FPGA core.
• Package and Mounting 784-FCBGA (29×29) FCBGA package in a surface-mount form factor for compact board integration.
• Operating Range Rated for operation from –40 °C to 100 °C, appropriate for industrial temperature environments.
• Compliance RoHS compliant.

Typical Applications

• High-density logic systems Use the large logic element count to implement complex state machines, custom datapaths, and parallel processing blocks.
• Memory-centric designs Leverage approximately 12.68 Mbits of embedded RAM for buffering, packet processing, and on-chip data storage.
• I/O-rich platforms Support multiple interfaces and external devices with up to 400 I/O pins.
• Industrial embedded systems Designed for industrial temperature ranges and surface-mount integration in ruggedized electronics.

Unique Advantages

• High programmable density: 199,680 logic elements enable integration of complex functions on a single device, reducing system BOM.
• Substantial on-chip memory: Approximately 12.68 Mbits of embedded RAM minimizes external memory requirements for many designs.
• Large I/O complement: 400 I/O pins provide flexibility for multi-channel connectivity and diverse peripheral interfaces.
• Industrial temperature tolerance: Rated from –40 °C to 100 °C for deployment in temperature-demanding environments.
• Compact surface-mount package: 784-FCBGA (29×29) packaging supports high-density board layouts while maintaining robust connections.
• Regulatory compliance: RoHS compliant for use in lead-free manufacturing processes.

Why Choose XC6VCX195T-2FF784I?

The XC6VCX195T-2FF784I positions itself as a high-capacity, industrial-grade FPGA delivering a combination of extensive logic resources, substantial embedded memory, and a large I/O complement in a compact FCBGA package. Its specified voltage range and wide operating temperature make it suitable for demanding embedded applications where integration density and thermal robustness matter.

This device is well suited for engineers and design teams targeting complex, memory- and I/O-intensive projects that benefit from consolidating functionality into a single programmable device while maintaining compliance with RoHS requirements.

Request a quote or submit your procurement inquiry today to evaluate the XC6VCX195T-2FF784I for your next design.