XC6VCX240T-1FFG784I

The XC6VCX240T-1FFG784I is a Virtex®-6 CXT field programmable gate array (FPGA) IC from AMD, provided in a 784-ball FCBGA (29×29) package. It delivers high logic density and substantial on-chip memory in an industrial-grade, surface-mount package suitable for demanding embedded and system-level designs.

Key Features

• Core / Logic: 18,840 CLBs and 241,152 logic elements provide extensive programmable logic capacity for complex digital designs and high-performance custom logic implementation.
• Embedded Memory: Approximately 15.3 Mbits of total on-chip RAM to support large buffers, FIFOs, and state storage without external memory.
• I/O Capacity: 400 I/O pins to accommodate broad interfacing needs across peripherals, buses, and system interconnects.
• Power Supply: Nominal core voltage range of 950 mV to 1.05 V to match typical Virtex-6 core power requirements.
• Package & Mounting: 784-BBGA / 784-FCBGA (29×29) surface-mount package for high-density board integration and robust mechanical performance.
• Temperature & Grade: Industrial grade with an operating temperature range of −40 °C to 100 °C for deployments in temperature-challenging environments.
• Compliance: RoHS compliant to support regulatory and environmental requirements.

Typical Applications

• High-density signal processing: Uses large logic capacity and on-chip RAM to implement complex digital signal processing pipelines and real-time data manipulation.
• Network and communications infrastructure: Leverages extensive I/O and logic resources to implement protocol processing, packet handling, and custom switching logic.
• Embedded compute and control: Provides the programmable logic and memory needed for embedded controllers, protocol bridges, and hardware accelerators in industrial systems.

Unique Advantages

• High logic density: 241,152 logic elements and 18,840 CLBs enable consolidation of complex functions into a single FPGA, reducing system BOM and board complexity.
• Substantial on-chip memory: Approximately 15.3 Mbits of embedded RAM reduces dependence on external memory, lowering latency and simplifying PCB design.
• Robust I/O count: 400 I/Os support wide connectivity options for sensors, interfaces, and high-pin-count peripherals without external multiplexing.
• Industrial temperature range: Rated −40 °C to 100 °C to meet the needs of temperature-challenging deployments and improve system reliability in harsh environments.
• Compact BGA package: 784-FCBGA (29×29) provides a high-density footprint for space-constrained designs while maintaining strong electrical and mechanical characteristics.
• RoHS compliance: Environmentally compliant manufacturing aligns with common regulatory and corporate sourcing requirements.

Why Choose XC6VCX240T-1FFG784I?

The XC6VCX240T-1FFG784I positions itself as a high-capacity, industrial-grade FPGA option for designers who require significant programmable logic, embedded memory, and extensive I/O in a single, surface-mount package. Its combination of 241,152 logic elements, approximately 15.3 Mbits of on-chip RAM, and 400 I/Os makes it well suited for complex signal processing, communications, and embedded compute applications where consolidation and reliability matter.

Manufactured by AMD and provided in a 784-FCBGA (29×29) package, this device supports designers seeking scalable, high-density hardware solutions with defined operating-voltage and temperature ranges for robust system integration.

Request a quote or submit an inquiry today to check availability and pricing for the XC6VCX240T-1FFG784I and to discuss how it can be integrated into your next high-density FPGA design.