XC6VCX240T-2FFG1156I

The XC6VCX240T-2FFG1156I is a Virtex®-6 CXT field-programmable gate array from AMD designed for high-density, configurable logic applications. This industrial-grade, surface-mount FPGA provides a large logic fabric, substantial embedded memory, and a high I/O count in a 1156-ball FCBGA package, enabling complex system integration where logic capacity, I/O density, and industrial temperature range are required.

Key Features

• Core Logic  Provides 241,152 logic elements for implementing large-scale digital designs and complex algorithms.
• Embedded Memory  Approximately 15.3 Mbits of on-chip RAM for buffering, state storage, and data processing without external memory.
• I/O Density  600 I/O pins to support extensive peripheral interfacing and multi-channel connectivity directly from the FPGA.
• Package  1156-ball BGA (1156-FCBGA, 35×35 mm) surface-mount package for high pin-count system integration and board-level routing efficiency.
• Power  Core voltage supply range from 0.95 V to 1.05 V to match system power delivery and enable stable core operation within specified limits.
• Environmental & Mounting  Industrial grade with an operating temperature range of −40 °C to 100 °C and RoHS compliance; designed for surface-mount assembly.

Typical Applications

• High-density digital processing  Systems that require extensive programmable logic and on-chip memory to implement complex algorithms and data paths.
• Multi-channel I/O systems  Applications needing a large number of external interfaces and signals, taking advantage of the 600 I/O pins.
• Industrial embedded systems  Deployments that demand industrial temperature capability (−40 °C to 100 °C) and robust surface-mount packaging.

Unique Advantages

• High logic capacity: 241,152 logic elements enable consolidation of multiple functions into a single device, reducing board-level component count.
• Substantial on-chip memory: Approximately 15.3 Mbits of embedded RAM reduces dependence on external memory for many buffering and storage needs.
• Extensive I/O coverage: 600 I/Os simplify direct sensor, actuator, and peripheral connections without additional multiplexing hardware.
• Industrial temperature rating: Qualified for −40 °C to 100 °C operation to support deployments in harsh or variable environments.
• Compact, high-pin-count package: 1156-FCBGA (35×35 mm) enables dense integration on modern PCBs while maintaining high routing flexibility.
• RoHS compliant: Meets environmental directive requirements for lead-free assembly and regulatory alignment.

Why Choose XC6VCX240T-2FFG1156I?

The XC6VCX240T-2FFG1156I positions itself as a high-capacity, industrial-grade FPGA option for designs that require a large programmable fabric, significant embedded memory, and extensive I/O in a single surface-mount package. Its combination of 241,152 logic elements, approximately 15.3 Mbits of on-chip RAM, and 600 I/Os makes it suitable for consolidating complex functions and reducing system BOM.

Engineers and procurement teams will find long-term value in the device’s industrial temperature capability, RoHS compliance, and compact 1156-FCBGA packaging, enabling scalable, robust designs where board space and reliable operation across a wide temperature range are priorities.

Request a quote or submit an inquiry to get pricing and availability for the XC6VCX240T-2FFG1156I. Our team can assist with lead times and procurement details.