XC6VHX250T-1FF1154I

The XC6VHX250T-1FF1154I is a Virtex®-6 HXT field programmable gate array from AMD, provided in a 1156-ball FCBGA package. It delivers high logic density, substantial on-chip RAM, and a broad I/O complement for complex, industrial-grade digital designs.

Key attributes include 251,904 logic elements, approximately 18.58 Mbits of embedded memory, 320 user I/O pins, a supply operating range of 0.95 V to 1.05 V, and an industrial temperature rating of -40 °C to 100 °C.

Key Features

• Logic Capacity — 251,904 logic elements provide a large configurable fabric for dense digital implementations.
• Embedded Memory — Approximately 18.58 Mbits of on-chip RAM supports buffering, lookup tables, and local storage for data-path and control logic.
• I/O and Connectivity — 320 user I/O pins enable extensive external interfacing and board-level signal routing.
• Power Supply — Core voltage range of 0.95 V to 1.05 V for compatibility with system power-rail designs.
• Package and Mounting — 1156-FCBGA (35×35) supplier device package, surface-mount mounting type, suitable for compact board implementations.
• Industrial Temperature Grade — Rated for operation from -40 °C to 100 °C to meet demanding environmental requirements.
• Regulatory Compliance — RoHS compliant to support regulated manufacturing processes.

Typical Applications

• High-density programmable logic systems — Suited for designs that require a large number of logic elements and extensive I/O.
• Memory-intensive processing — Appropriate where substantial on-chip RAM (approximately 18.58 Mbits) is needed for buffering or local data storage.
• Industrial embedded systems — Industrial temperature rating and robust packaging support deployment in temperature-critical environments.

Unique Advantages

• High logic count: 251,904 logic elements enable implementation of complex algorithms and large custom logic blocks on a single device.
• Significant on-chip memory: Approximately 18.58 Mbits of embedded RAM reduces dependence on external memory and lowers BOM complexity.
• Generous I/O capacity: 320 user I/Os simplify interfacing to peripherals, sensors, and system-level buses without extensive multiplexing.
• Industrial-ready thermal range: Operation from -40 °C to 100 °C supports deployment in harsh or temperature-variable settings.
• Compact, surface-mount FCBGA package: The 1156-FCBGA (35×35) footprint enables high-density PCB layouts while maintaining robust soldered connections.
• RoHS compliant: Conforms to materials compliance requirements for modern manufacturing environments.

Why Choose XC6VHX250T-1FF1154I?

The XC6VHX250T-1FF1154I combines large-scale programmable logic, substantial embedded memory, and a wide I/O complement in an industrial-grade FCBGA package. This configuration targets designs that need dense logic integration, local memory resources, and reliable operation across a broad temperature range.

As a Virtex®-6 HXT device from AMD, it offers a high-capacity platform for engineers developing complex digital systems where integration, configurability, and environmental robustness are priorities.

If you would like pricing or availability information, request a quote or submit an inquiry to receive a formal quotation for the XC6VHX250T-1FF1154I.