XC6VCX75T-1FFG784I
| Part Description |
Virtex®-6 CXT Field Programmable Gate Array (FPGA) IC 360 5750784 74496 784-BBGA, FCBGA |
|---|---|
| Quantity | 695 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 784-FCBGA (29x29) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 784-BBGA, FCBGA | Number of I/O | 360 | Voltage | 950 mV - 1.05 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 5820 | Number of Logic Elements/Cells | 74496 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 5750784 |
Overview of XC6VCX75T-1FFG784I – Virtex-6 CXT Field Programmable Gate Array, 784-FCBGA
The XC6VCX75T-1FFG784I is a Virtex-6 CXT Field Programmable Gate Array (FPGA) offered in a 784-ball FCBGA package. It provides substantial programmable logic capacity and on-chip memory in a surface-mount, industrial-grade package.
Key device attributes include 74,496 logic elements, approximately 5.75 Mbits of embedded memory, 360 user I/O pins, a 0.95 V–1.05 V core supply range, and an industrial operating range of −40 °C to 100 °C.
Key Features
- Programmable Logic 74,496 logic elements for implementing complex digital logic and custom hardware functions.
- Embedded Memory Approximately 5.75 Mbits of on-chip RAM to support large buffering, state storage, and memory-intensive algorithms.
- I/O Capacity 360 user I/O pins to support wide parallel interfaces and multiple external connections.
- Power Core voltage supply range of 0.95 V to 1.05 V to match required FPGA core operating conditions.
- Package & Mounting 784-ball FCBGA (784-FCBGA, 29×29) surface-mount package providing a compact, board-mountable form factor.
- Temperature & Grade Industrial-grade device rated for operation from −40 °C to 100 °C and compliant with RoHS environmental standards.
Unique Advantages
- High logic density: 74,496 logic elements enable implementation of large-scale designs within a single FPGA device.
- Substantial on-chip memory: Approximately 5.75 Mbits of embedded RAM reduces reliance on external memory for many buffering and storage tasks.
- Extensive I/O: 360 I/O pins allow flexible interfacing to multiple peripherals and parallel buses without additional I/O expansion.
- Industrial temperature rating: −40 °C to 100 °C operation supports deployment in temperature-challenging environments.
- Compact surface-mount package: 784-FCBGA (29×29) package provides a high-density, board-friendly solution for space-constrained designs.
- Regulatory compliance: RoHS compliance supports environmentally conscious designs and global manufacturing requirements.
Why Choose XC6VCX75T-1FFG784I?
The XC6VCX75T-1FFG784I combines high logic capacity, significant embedded memory, and broad I/O in an industrial-grade FPGA package. These measured specifications make it suitable for designs that require integrated programmable logic, substantial on-chip storage, and robust operation across a wide temperature range.
For engineering teams and procurement seeking a single-device solution with clear, verifiable capabilities—logic element count, embedded RAM, I/O capacity, core voltage range, and industrial qualification—this Virtex-6 CXT device presents a well-specified option aligned with those hardware requirements.
Request a quote or submit an inquiry to receive pricing and availability for XC6VCX75T-1FFG784I.

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