XC6VCX75T-1FFG784I

IC FPGA 360 I/O 784FCBGA
Part Description

Virtex®-6 CXT Field Programmable Gate Array (FPGA) IC 360 5750784 74496 784-BBGA, FCBGA

Quantity 695 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package784-FCBGA (29x29)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case784-BBGA, FCBGANumber of I/O360Voltage950 mV - 1.05 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs5820Number of Logic Elements/Cells74496
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits5750784

Overview of XC6VCX75T-1FFG784I – Virtex-6 CXT Field Programmable Gate Array, 784-FCBGA

The XC6VCX75T-1FFG784I is a Virtex-6 CXT Field Programmable Gate Array (FPGA) offered in a 784-ball FCBGA package. It provides substantial programmable logic capacity and on-chip memory in a surface-mount, industrial-grade package.

Key device attributes include 74,496 logic elements, approximately 5.75 Mbits of embedded memory, 360 user I/O pins, a 0.95 V–1.05 V core supply range, and an industrial operating range of −40 °C to 100 °C.

Key Features

  • Programmable Logic 74,496 logic elements for implementing complex digital logic and custom hardware functions.
  • Embedded Memory Approximately 5.75 Mbits of on-chip RAM to support large buffering, state storage, and memory-intensive algorithms.
  • I/O Capacity 360 user I/O pins to support wide parallel interfaces and multiple external connections.
  • Power Core voltage supply range of 0.95 V to 1.05 V to match required FPGA core operating conditions.
  • Package & Mounting 784-ball FCBGA (784-FCBGA, 29×29) surface-mount package providing a compact, board-mountable form factor.
  • Temperature & Grade Industrial-grade device rated for operation from −40 °C to 100 °C and compliant with RoHS environmental standards.

Unique Advantages

  • High logic density: 74,496 logic elements enable implementation of large-scale designs within a single FPGA device.
  • Substantial on-chip memory: Approximately 5.75 Mbits of embedded RAM reduces reliance on external memory for many buffering and storage tasks.
  • Extensive I/O: 360 I/O pins allow flexible interfacing to multiple peripherals and parallel buses without additional I/O expansion.
  • Industrial temperature rating: −40 °C to 100 °C operation supports deployment in temperature-challenging environments.
  • Compact surface-mount package: 784-FCBGA (29×29) package provides a high-density, board-friendly solution for space-constrained designs.
  • Regulatory compliance: RoHS compliance supports environmentally conscious designs and global manufacturing requirements.

Why Choose XC6VCX75T-1FFG784I?

The XC6VCX75T-1FFG784I combines high logic capacity, significant embedded memory, and broad I/O in an industrial-grade FPGA package. These measured specifications make it suitable for designs that require integrated programmable logic, substantial on-chip storage, and robust operation across a wide temperature range.

For engineering teams and procurement seeking a single-device solution with clear, verifiable capabilities—logic element count, embedded RAM, I/O capacity, core voltage range, and industrial qualification—this Virtex-6 CXT device presents a well-specified option aligned with those hardware requirements.

Request a quote or submit an inquiry to receive pricing and availability for XC6VCX75T-1FFG784I.

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