XC6VCX195T-2FFG784C

IC FPGA 400 I/O 784FCBGA
Part Description

Virtex®-6 CXT Field Programmable Gate Array (FPGA) IC 400 12681216 199680 784-BBGA, FCBGA

Quantity 1,208 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package784-FCBGA (29x29)GradeCommercialOperating Temperature0°C – 85°C
Package / Case784-BBGA, FCBGANumber of I/O400Voltage950 mV - 1.05 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs15600Number of Logic Elements/Cells199680
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits12681216

Overview of XC6VCX195T-2FFG784C – Virtex®-6 CXT Field Programmable Gate Array (FPGA), 784‑BBGA

The XC6VCX195T-2FFG784C is a Virtex®-6 CXT field programmable gate array IC from AMD designed for commercial-grade applications. It provides a large on-chip logic capacity and embedded memory, making it suitable for designs that require substantial programmable logic and memory resources while fitting into a compact 784-ball FCBGA package.

Key value propositions include significant logic density, multiple I/O capability, and a narrow core voltage operating window for tightly controlled power domains.

Key Features

  • Logic Capacity  199,680 logic elements provide extensive programmable logic resources for complex digital designs.
  • Embedded Memory  Approximately 12.7 Mbits of on-chip RAM for buffering, lookup tables, and local data storage.
  • I/O Resources  400 I/O pins to support broad interfacing options with external devices and subsystems.
  • Power  Core voltage supply range from 950 mV to 1.05 V, enabling predictable core power design.
  • Package  784‑BBGA (784‑FCBGA) package, supplier device package 784‑FCBGA (29×29), providing a compact footprint for high-density boards.
  • Mounting and Grade  Surface-mount mounting type and commercial temperature grade (0 °C to 85 °C).
  • Environmental Compliance  RoHS compliant for regulatory and manufacturing considerations.

Unique Advantages

  • High logic density: 199,680 logic elements enable consolidation of complex functions on a single device, reducing board-level component count.
  • On-chip memory: Approximately 12.7 Mbits of embedded RAM supports local data storage and high-bandwidth buffering without external memory.
  • Extensive I/O: 400 I/O pins allow flexible interfacing and support for multiple peripheral domains.
  • Compact package: 784‑ball FCBGA (29×29) provides a small footprint for space-constrained commercial systems.
  • Predictable power domain: Narrow core voltage range (950 mV–1.05 V) aids in stable power-supply design and voltage regulation planning.
  • Compliance-ready: RoHS compliance simplifies environmental and manufacturing requirements.

Why Choose XC6VCX195T-2FFG784C?

The XC6VCX195T-2FFG784C positions itself as a high-capacity, commercial-grade FPGA option for designs that require significant programmable logic, on-chip memory, and a large number of I/Os in a compact BGA package. With defined operating temperature and core voltage ranges, it supports predictable thermal and power planning in commercial systems.

Manufactured by AMD and delivered in a 784‑FCBGA (29×29) package, this device is suitable for development teams looking to consolidate functionality onto a single FPGA to reduce BOM complexity and board area while maintaining clear electrical and environmental specifications.

Request a quote or submit a product inquiry to receive pricing and availability information for the XC6VCX195T-2FFG784C.

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