XC6VCX195T-2FFG784C
| Part Description |
Virtex®-6 CXT Field Programmable Gate Array (FPGA) IC 400 12681216 199680 784-BBGA, FCBGA |
|---|---|
| Quantity | 1,208 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 784-FCBGA (29x29) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 784-BBGA, FCBGA | Number of I/O | 400 | Voltage | 950 mV - 1.05 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 15600 | Number of Logic Elements/Cells | 199680 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 12681216 |
Overview of XC6VCX195T-2FFG784C – Virtex®-6 CXT Field Programmable Gate Array (FPGA), 784‑BBGA
The XC6VCX195T-2FFG784C is a Virtex®-6 CXT field programmable gate array IC from AMD designed for commercial-grade applications. It provides a large on-chip logic capacity and embedded memory, making it suitable for designs that require substantial programmable logic and memory resources while fitting into a compact 784-ball FCBGA package.
Key value propositions include significant logic density, multiple I/O capability, and a narrow core voltage operating window for tightly controlled power domains.
Key Features
- Logic Capacity 199,680 logic elements provide extensive programmable logic resources for complex digital designs.
- Embedded Memory Approximately 12.7 Mbits of on-chip RAM for buffering, lookup tables, and local data storage.
- I/O Resources 400 I/O pins to support broad interfacing options with external devices and subsystems.
- Power Core voltage supply range from 950 mV to 1.05 V, enabling predictable core power design.
- Package 784‑BBGA (784‑FCBGA) package, supplier device package 784‑FCBGA (29×29), providing a compact footprint for high-density boards.
- Mounting and Grade Surface-mount mounting type and commercial temperature grade (0 °C to 85 °C).
- Environmental Compliance RoHS compliant for regulatory and manufacturing considerations.
Unique Advantages
- High logic density: 199,680 logic elements enable consolidation of complex functions on a single device, reducing board-level component count.
- On-chip memory: Approximately 12.7 Mbits of embedded RAM supports local data storage and high-bandwidth buffering without external memory.
- Extensive I/O: 400 I/O pins allow flexible interfacing and support for multiple peripheral domains.
- Compact package: 784‑ball FCBGA (29×29) provides a small footprint for space-constrained commercial systems.
- Predictable power domain: Narrow core voltage range (950 mV–1.05 V) aids in stable power-supply design and voltage regulation planning.
- Compliance-ready: RoHS compliance simplifies environmental and manufacturing requirements.
Why Choose XC6VCX195T-2FFG784C?
The XC6VCX195T-2FFG784C positions itself as a high-capacity, commercial-grade FPGA option for designs that require significant programmable logic, on-chip memory, and a large number of I/Os in a compact BGA package. With defined operating temperature and core voltage ranges, it supports predictable thermal and power planning in commercial systems.
Manufactured by AMD and delivered in a 784‑FCBGA (29×29) package, this device is suitable for development teams looking to consolidate functionality onto a single FPGA to reduce BOM complexity and board area while maintaining clear electrical and environmental specifications.
Request a quote or submit a product inquiry to receive pricing and availability information for the XC6VCX195T-2FFG784C.

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