XC6VCX195T-1FFG784I

IC FPGA 400 I/O 784FCBGA
Part Description

Virtex®-6 CXT Field Programmable Gate Array (FPGA) IC 400 12681216 199680 784-BBGA, FCBGA

Quantity 225 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package784-FCBGA (29x29)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case784-BBGA, FCBGANumber of I/O400Voltage950 mV - 1.05 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs15600Number of Logic Elements/Cells199680
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits12681216

Overview of XC6VCX195T-1FFG784I – Virtex®-6 CXT Field Programmable Gate Array (FPGA) IC

The XC6VCX195T-1FFG784I is a Virtex®-6 CXT field programmable gate array (FPGA) IC from AMD, delivered in a 784-BBGA (784-FCBGA, 29×29) surface-mount package. It provides a high logic element count, substantial embedded RAM, and a large number of I/O pins for demanding programmable-logic implementations.

Designed and specified for industrial-grade environments, the device supports extended operating temperatures and RoHS compliance, making it suitable for industrial designs that require programmable logic, significant on-chip memory, and broad I/O integration.

Key Features

  • Logic Capacity  199,680 logic elements for complex, high-density designs.
  • Configurable Logic Blocks (CLBs)  15,600 CLBs to structure and implement programmable logic functions.
  • Embedded Memory  Approximately 12.68 Mbits of on-chip RAM to support buffering, packet processing, and algorithm state storage.
  • I/O Integration  400 general-purpose I/O pins to interface with peripherals, sensors, and external logic.
  • Power Supply Range  Core voltage range of 0.95 V to 1.05 V for defined supply/operating conditions.
  • Package and Mounting  784-FCBGA (29×29) 784-BBGA package in a surface-mount form factor for compact board-level integration.
  • Temperature and Grade  Industrial-grade device specified for operation from −40 °C to 100 °C.
  • Regulatory Compliance  RoHS compliant.

Typical Applications

  • Industrial Control Systems  Programmable logic and extended operating temperature make this part suitable for industrial automation and control applications.
  • High-Density I/O Interfaces  With 400 I/Os, the device supports designs that require many external connections and dense board-level integration.
  • Memory-Intensive Embedded Processing  Approximately 12.68 Mbits of on-chip RAM enables buffering and local data handling for embedded algorithms.

Unique Advantages

  • High Logic Capacity: 199,680 logic elements allow implementation of complex logic, state machines, and custom datapaths without immediate need for external logic.
  • Significant On-Chip Memory: Approximately 12.68 Mbits of embedded RAM reduces dependence on external memory for many mid-sized designs.
  • Extensive I/O: 400 I/O pins provide flexibility for multi-interface systems and dense peripheral connectivity.
  • Industrial Temperature Range: Specified operation from −40 °C to 100 °C supports deployment in thermally demanding environments.
  • Compact Surface-Mount FCBGA Package: 784-FCBGA (29×29) package balances high integration density with board-level assembly compatibility.
  • Defined Core Voltage Window: 0.95–1.05 V supply specification enables controlled power design and predictable core operating conditions.

Why Choose XC6VCX195T-1FFG784I?

The XC6VCX195T-1FFG784I positions itself as a high-capacity, industrial-grade FPGA option that combines extensive programmable logic, on-chip memory, and a large I/O count in a compact 784-FCBGA surface-mount package. Its temperature rating and RoHS compliance make it suitable for industrial deployments where board space, reliability, and predictable electrical parameters matter.

This device is well suited for design teams that need to integrate substantial logic and memory on-chip while maintaining broad external connectivity. Backed by AMD’s Virtex®-6 family lineage and provided in an industrial package, it supports long-term designs where density, integration, and environmental tolerance are key considerations.

Request a quote or submit an inquiry to receive pricing and availability information for XC6VCX195T-1FFG784I.

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