XC6VCX195T-1FFG784I
| Part Description |
Virtex®-6 CXT Field Programmable Gate Array (FPGA) IC 400 12681216 199680 784-BBGA, FCBGA |
|---|---|
| Quantity | 225 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 784-FCBGA (29x29) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 784-BBGA, FCBGA | Number of I/O | 400 | Voltage | 950 mV - 1.05 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 15600 | Number of Logic Elements/Cells | 199680 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 12681216 |
Overview of XC6VCX195T-1FFG784I – Virtex®-6 CXT Field Programmable Gate Array (FPGA) IC
The XC6VCX195T-1FFG784I is a Virtex®-6 CXT field programmable gate array (FPGA) IC from AMD, delivered in a 784-BBGA (784-FCBGA, 29×29) surface-mount package. It provides a high logic element count, substantial embedded RAM, and a large number of I/O pins for demanding programmable-logic implementations.
Designed and specified for industrial-grade environments, the device supports extended operating temperatures and RoHS compliance, making it suitable for industrial designs that require programmable logic, significant on-chip memory, and broad I/O integration.
Key Features
- Logic Capacity 199,680 logic elements for complex, high-density designs.
- Configurable Logic Blocks (CLBs) 15,600 CLBs to structure and implement programmable logic functions.
- Embedded Memory Approximately 12.68 Mbits of on-chip RAM to support buffering, packet processing, and algorithm state storage.
- I/O Integration 400 general-purpose I/O pins to interface with peripherals, sensors, and external logic.
- Power Supply Range Core voltage range of 0.95 V to 1.05 V for defined supply/operating conditions.
- Package and Mounting 784-FCBGA (29×29) 784-BBGA package in a surface-mount form factor for compact board-level integration.
- Temperature and Grade Industrial-grade device specified for operation from −40 °C to 100 °C.
- Regulatory Compliance RoHS compliant.
Typical Applications
- Industrial Control Systems Programmable logic and extended operating temperature make this part suitable for industrial automation and control applications.
- High-Density I/O Interfaces With 400 I/Os, the device supports designs that require many external connections and dense board-level integration.
- Memory-Intensive Embedded Processing Approximately 12.68 Mbits of on-chip RAM enables buffering and local data handling for embedded algorithms.
Unique Advantages
- High Logic Capacity: 199,680 logic elements allow implementation of complex logic, state machines, and custom datapaths without immediate need for external logic.
- Significant On-Chip Memory: Approximately 12.68 Mbits of embedded RAM reduces dependence on external memory for many mid-sized designs.
- Extensive I/O: 400 I/O pins provide flexibility for multi-interface systems and dense peripheral connectivity.
- Industrial Temperature Range: Specified operation from −40 °C to 100 °C supports deployment in thermally demanding environments.
- Compact Surface-Mount FCBGA Package: 784-FCBGA (29×29) package balances high integration density with board-level assembly compatibility.
- Defined Core Voltage Window: 0.95–1.05 V supply specification enables controlled power design and predictable core operating conditions.
Why Choose XC6VCX195T-1FFG784I?
The XC6VCX195T-1FFG784I positions itself as a high-capacity, industrial-grade FPGA option that combines extensive programmable logic, on-chip memory, and a large I/O count in a compact 784-FCBGA surface-mount package. Its temperature rating and RoHS compliance make it suitable for industrial deployments where board space, reliability, and predictable electrical parameters matter.
This device is well suited for design teams that need to integrate substantial logic and memory on-chip while maintaining broad external connectivity. Backed by AMD’s Virtex®-6 family lineage and provided in an industrial package, it supports long-term designs where density, integration, and environmental tolerance are key considerations.
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