XC6VCX195T-2FFG1156C

The XC6VCX195T-2FFG1156C is a Virtex®-6 CXT Field Programmable Gate Array (FPGA) IC from AMD. It provides a combination of on-chip logic, embedded memory, and I/O capacity in a 1156-ball FCBGA package for surface-mount applications.

Key device attributes include 199,680 logic elements, 15,600 configurable logic blocks (CLBs), approximately 12.68 Mbits of embedded RAM, up to 600 I/O, a 950 mV to 1.05 V core supply range, commercial-grade operation from 0 °C to 85 °C, and RoHS compliance.

Key Features

• Logic Capacity — 199,680 logic elements implemented across 15,600 configurable logic blocks (CLBs) for large-scale programmable logic implementations.
• Embedded Memory — Total on-chip RAM of approximately 12.68 Mbits to support buffering, lookup tables, and state storage without external memory.
• I/O Resources — Up to 600 I/O pins to support high-density connectivity to peripherals and external devices.
• Power — Core voltage supply range from 950 mV to 1.05 V to match system power domains.
• Package and Mounting — 1156-ball FCBGA package (1156-FCBGA, 35×35) designed for surface-mount placement.
• Operating Conditions — Commercial grade with specified operating temperature range of 0 °C to 85 °C and RoHS compliance.

Typical Applications

• High-density I/O systems — Up to 600 I/O pins enable complex interfacing and routing to multiple peripherals or high-channel-count systems.
• Large-scale programmable logic — 199,680 logic elements and 15,600 CLBs support complex logic implementations and extensive custom processing blocks.
• Memory-intensive designs — Approximately 12.68 Mbits of embedded RAM provides on-chip buffering and data storage for designs that rely on internal memory resources.

Unique Advantages

• Significant on-chip resources: A combination of nearly 200k logic elements and roughly 12.68 Mbits of RAM reduces reliance on external logic and memory components.
• High I/O capacity: 600 I/O pins allow direct connection to numerous peripherals and parallel interfaces, simplifying board-level design.
• Compact FCBGA package: The 1156-ball FCBGA (35×35) provides a dense, surface-mount form factor for space-constrained PCBs.
• Power domain compatibility: Core supply range of 950 mV to 1.05 V facilitates integration into modern low-voltage power architectures.
• Commercial-grade and RoHS compliant: Specified 0 °C to 85 °C operating range and RoHS compliance support standard commercial deployments and regulatory requirements for lead-free assemblies.

Why Choose XC6VCX195T-2FFG1156C?

The XC6VCX195T-2FFG1156C positions itself as a high-capacity Virtex-6 CXT FPGA option from AMD, combining extensive logic resources, substantial embedded memory, and a large I/O complement in a single 1156-FCBGA package. Its electrical and environmental specifications make it suitable for commercial electronic designs that require substantial on-chip resources and dense connectivity.

This device is suited to design teams and procurement groups seeking a scalable FPGA solution with verifiable on-chip logic, memory, and I/O counts, along with RoHS compliance and a defined commercial operating temperature range.

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