XC6VCX75T-1FFG784C

IC FPGA 360 I/O 784FCBGA
Part Description

Virtex®-6 CXT Field Programmable Gate Array (FPGA) IC 360 5750784 74496 784-BBGA, FCBGA

Quantity 407 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package784-FCBGA (29x29)GradeCommercialOperating Temperature0°C – 85°C
Package / Case784-BBGA, FCBGANumber of I/O360Voltage950 mV - 1.05 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs5820Number of Logic Elements/Cells74496
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits5750784

Overview of XC6VCX75T-1FFG784C – Virtex®-6 CXT Field Programmable Gate Array, 784‑FCBGA

The XC6VCX75T-1FFG784C is a Virtex®-6 CXT class FPGA from AMD designed for applications that require high integration of logic, memory and high-speed serial interfaces. This surface-mount device provides approximately 74,496 logic elements (based on the device's logic cell count) and roughly 5.75 Mbits of embedded memory, making it suitable for compute- and I/O-intensive designs in commercial-temperature environments.

Built on the Virtex-6 CXT architecture, the device targets designs that benefit from integrated transceivers, programmable I/O, and embedded system blocks—enabling performance, integration and flexibility for networking, signal processing and high-speed interface applications.

Key Features

  • Logic Capacity — Approximately 74,496 logic elements and 5,820 CLBs provide a substantial fabric for implementing custom logic, state machines and protocol handling.
  • Embedded Memory — Total on-chip RAM of 5,750,784 bits (approximately 5.75 Mbits) with the Virtex-6 CXT family architecture that supports 36-Kb block RAM/FIFOs and flexible dual-port configurations.
  • High‑Speed Serial — Family-level GTX transceiver support up to 3.75 Gb/s for multi‑Gb/s serial links and SerDes applications, suitable for serial communications and protocol bridging.
  • Integrated Interfaces — Series features include integrated PCI Express® (Gen1) blocks and a tri‑mode Ethernet MAC, enabling embedded endpoint and networking functions within the FPGA fabric.
  • I/O and SelectIO Technology — 360 I/O pins with SelectIO capabilities and flexible I/O banking to support a range of I/O standards and memory interface topologies.
  • Power and Operating Range — Core supply range of 0.95 V to 1.05 V (device core nominally 1.0 V) and commercial operating range from 0 °C to 85 °C, for standard commercial deployments.
  • Package — 784-ball FCBGA package (29 × 29 mm) in a surface-mount form factor for dense board-level integration and high signal-integrity routing.
  • RoHS Compliant — Meets RoHS environmental requirements.

Typical Applications

  • High‑speed communications — Implement multi‑Gb/s serial links and protocol converters using the device’s GTX transceiver capability and rich I/O.
  • Networking and infrastructure — Integrate Ethernet MAC functionality and programmable logic for packet processing, switch control and custom networking features.
  • Signal processing and DSP — Use the device’s embedded memory and DSP-focused fabric features (from the Virtex‑6 CXT family) for filtering, aggregation and real‑time data processing.
  • PCI Express endpoints — Develop Gen1 PCIe endpoint implementations leveraging the integrated PCI Express interface blocks described in the Virtex‑6 CXT feature set.

Unique Advantages

  • Substantial logic resources: Approximately 74,496 logic elements and 5,820 CLBs enable complex custom logic and large FPGA designs without external logic expansion.
  • Significant embedded memory: About 5.75 Mbits of on‑chip RAM supports buffering, FIFOs and on‑chip data storage to reduce external memory dependence.
  • Integrated serial and interface IP: Family-level support for GTX transceivers, PCIe Gen1 blocks and an Ethernet MAC reduces board-level component count and design complexity.
  • Flexible I/O count and packaging: 360 I/Os in a 784‑FCBGA (29×29) package provide a high pin-count solution for dense I/O and multi‑lane interfaces.
  • Commercial temperature suitability: Rated for 0 °C to 85 °C operation, appropriate for mainstream commercial applications.
  • RoHS compliant: Meets environmental compliance requirements for modern electronic assemblies.

Why Choose XC6VCX75T-1FFG784C?

The XC6VCX75T-1FFG784C combines a substantial logic fabric with embedded memory and family-level integrated serial and interface blocks to support designs that need a balance of compute, memory and high-speed I/O. Its 784‑ball FCBGA package and 360 I/Os make it a compact, board-friendly option for commercial projects that require dense routing and multi‑lane interfaces.

This device is well suited to engineering teams building networking gear, communication endpoints, or signal-processing platforms that can leverage the Virtex‑6 CXT family’s system-level features and the specific resource counts provided for this part. The combination of on-chip memory, logic capacity and integrated IP components offers a path to reduce external components and accelerate system integration.

Request a quote or submit an inquiry to get pricing and availability for XC6VCX75T-1FFG784C and to discuss how this device fits your next FPGA-based design.

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