XC6VHX250T-1FFG1154C

The XC6VHX250T-1FFG1154C is a Virtex®-6 HXT Field Programmable Gate Array (FPGA) IC from AMD, supplied in a 1156-FCBGA (35×35) package. It targets commercial-grade applications that require high logic capacity and substantial on-chip memory, delivering a balance of integration density, I/O count, and defined power and thermal limits for board-level designs.

Key Features

• Logic Capacity  251,904 logic elements provide a large fabric for complex, high-density programmable logic implementations.
• Embedded Memory  Approximately 18.58 Mbits of on-chip RAM to support buffering, state storage, and data-path implementations.
• I/O Count  320 available I/O pins to support multiple interfaces and parallel data paths at the board level.
• Power Supply  Core voltage range specified at 0.95 V to 1.05 V for planned power budgeting and supply design.
• Package & Mounting  1156-FCBGA (35×35) package in a surface-mount form factor for high pin-count, compact PCB integration.
• Operating Range & Grade  Commercial grade with an operating temperature range of 0 °C to 85 °C suitable for standard commercial environments.
• Compliance  RoHS compliant to meet standard environmental and material requirements.

Typical Applications

• Commercial Embedded Systems  Used where high-density programmable logic and on-chip memory are needed for board-level integration in commercial products.
• High-Density Logic Integration  Suited for designs that require a large number of logic elements and substantial embedded RAM within a single FPGA package.
• Multi-Interface Boards  High I/O count enables support for multiple parallel and serial interfaces on complex PCBs.

Unique Advantages

• High logic density: 251,904 logic elements enable implementation of large, complex designs without external programmable logic.
• Significant on-chip memory: Approximately 18.58 Mbits of embedded RAM reduces dependence on external memory for many data-path and buffering needs.
• Substantial I/O capacity: 320 I/O pins facilitate integration of multiple peripherals and wide data buses directly to the FPGA.
• Compact, high-pin package: 1156-FCBGA (35×35) provides a high-pin-count solution in a surface-mount form factor for dense PCB layouts.
• Commercial-grade specification: Specified 0 °C to 85 °C operating range and RoHS compliance align with standard commercial manufacturing and regulatory practices.
• Defined core supply range: 0.95 V to 1.05 V core voltage specification aids predictable power design and supply selection.

Why Choose XC6VHX250T-1FFG1154C?

The XC6VHX250T-1FFG1154C positions itself as a high-capacity Virtex®-6 HXT FPGA for commercial applications that need a combination of large logic resources, substantial embedded memory, and ample I/O in a compact FCBGA package. Its defined power and thermal specifications make it suitable for engineers planning board-level integration and power budgeting within commercial product constraints.

This part is appropriate for development teams and procurement focused on scalable, integrated programmable logic solutions that require high logic element counts, on-chip RAM, and a high pin-count surface-mount package backed by RoHS compliance.

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