XC6VHX250T-2FFG1154I

The XC6VHX250T-2FFG1154I is a Virtex-6 HXT Field Programmable Gate Array (FPGA) IC from AMD, delivered in a 1156-ball FCBGA package. It provides high logic density, substantial on-chip memory, and a broad I/O count in a surface-mount industrial-grade package with extended operating temperature range.

This device is suited for designs that require large amounts of programmable logic and embedded memory while operating across an industrial temperature range and at core voltages between 0.95 V and 1.05 V.

Key Features

• Core logic density  19,680 configurable logic blocks (CLBs) and 251,904 logic elements enable large-scale, complex digital designs.
• On-chip memory  Approximately 18.6 Mbits of embedded memory for buffering, state storage, and on-device data processing.
• I/O capacity  320 user I/O pins to support extensive interfacing with peripherals, sensors, and external logic.
• Power  Core voltage supply range of 0.95 V to 1.05 V to match common FPGA power architectures.
• Package & mounting  1156-ball FCBGA (35 × 35 mm) in a surface-mount package for compact board integration.
• Environmental & compliance  Industrial grade with operating temperature from -40 °C to 100 °C and RoHS compliance for regulatory compatibility.

Typical Applications

• High-density signal processing  Use the large logic element count and embedded memory to implement complex algorithms for DSP and data manipulation.
• Industrial control and automation  Industrial-grade temperature range and robust packaging make the device suitable for control systems and factory automation equipment.
• High-bandwidth I/O systems  320 I/Os provide the connectivity required for sensor arrays, interface aggregation, and peripheral-rich designs.
• Compact, board-level integration  The 1156-FCBGA package supports space-constrained systems that need high logic and memory density in a single device.

Unique Advantages

• High integration density: 251,904 logic elements and ~18.6 Mbits of embedded memory reduce the need for external logic and memory components.
• Broad I/O count: 320 I/Os simplify system-level interfacing and minimize additional bridge devices.
• Industrial-ready thermal range: Rated for -40 °C to 100 °C operation to support deployments in demanding environments.
• Compact FCBGA packaging: 1156-ball, 35 × 35 mm FCBGA offers a compact footprint for high-density board designs.
• Controlled core voltage range: 0.95 V to 1.05 V core supply compatibility for standard FPGA power domains.
• Regulatory compliance: RoHS compliant to meet environmental and manufacturing standards.

Why Choose XC6VHX250T-2FFG1154I?

The XC6VHX250T-2FFG1154I positions itself as a high-density FPGA option within the Virtex-6 HXT family from AMD, combining a large logic element count, significant on-chip memory, and extensive I/O in a single industrial-grade package. Its thermal rating and surface-mount FCBGA format make it appropriate for robust, space-constrained systems.

This part is well suited for engineers and design teams building complex digital systems that require substantial programmable resources, broad interfacing capability, and reliable operation across extended temperature ranges. Selecting this device can help consolidate functions onto a single FPGA, supporting simpler board designs and scalable implementations.

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