XC6VHX250T-3FFG1154C

The XC6VHX250T-3FFG1154C is a Virtex®-6 HXT FPGA IC from AMD supplied in a 1156-FCBGA (35×35) surface-mount package. It provides a large logic resource set and on-chip memory for complex, high-density digital designs.

With 251,904 logic elements, 19,680 CLBs, approximately 18.6 Mbits of embedded memory and 320 I/O pins, this device targets designs that require substantial logic capacity, significant embedded RAM and a high I/O count within a commercial temperature range.

Key Features

• Core Logic  Provides 19,680 CLBs and 251,904 logic elements (cells) to implement large, complex digital functions.
• Embedded Memory  Approximately 18.6 Mbits of on-chip RAM for buffering, lookup tables and state storage without external memory.
• I/O Density  320 general-purpose I/O pins to support wide parallel interfaces and multi-channel connectivity.
• Power  Core supply range specified at 0.95 V to 1.05 V to match system power-rail design requirements.
• Package & Mounting  1156-FCBGA (35×35) package in a surface-mount form factor for compact board-level integration.
• Temperature & Grade  Commercial grade operation from 0 °C to 85 °C and RoHS-compliant for standard commercial applications.

Typical Applications

• High-density digital processing  Use the extensive logic resources to implement complex signal processing, protocol handling or custom compute pipelines.
• Memory-intensive designs  Leverage approximately 18.6 Mbits of embedded RAM for buffering, frame storage or LUT-based implementations without adding external memory.
• I/O-rich interface hubs  Deploy the 320 I/O pins for multi-channel data acquisition, parallel buses or dense peripheral connectivity.
• Compact board integration  The 1156-FCBGA surface-mount package supports space-constrained board layouts requiring high integration.

Unique Advantages

• High logic capacity: 251,904 logic elements enable large-scale integration of custom logic and state machines on a single device, reducing component count.
• Significant on-chip memory: Approximately 18.6 Mbits of embedded RAM reduces reliance on external memory, simplifying BOM and layout.
• Ample I/O: 320 I/O pins provide flexible connectivity options for complex system interfaces and multiple parallel channels.
• Compact FCBGA package: 1156-FCBGA (35×35) supports high-density mounting while keeping board footprint minimized.
• Commercial temperature and RoHS compliance: Rated 0 °C to 85 °C and RoHS-compliant for standard commercial deployments and regulatory alignment.

Why Choose XC6VHX250T-3FFG1154C?

The XC6VHX250T-3FFG1154C combines large-scale logic resources, substantial embedded memory and a high I/O count in a compact 1156-FCBGA surface-mount package. These characteristics make it well suited for designers targeting high-density, memory-demanding and I/O-rich applications within commercial temperature environments.

Backed by AMD's Virtex-6 HXT family architecture, the device offers a balance of integration and board-level efficiency that supports scalable designs and reduces the need for multiple discrete components.

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